AT24C32D
Packaging Information
10.
Packaging Information
10.1
Package Marking Information
AT24C32D: Package Marking Information
8-lead TSSOP
8-lead SOIC
8-pad UDFN
2.0 x 3.0 mm Body
ATHYWW
###
ATMLHYWW
###% CO
YYWWNNN
###%CO
H%
YYWWNNN
NNN
8-pad XDFN
5-lead SOT23
8-ball VFBGA
1.8 x 2.2 mm Body
1.5 x 2.0 mm Body
##%UYY
WWNNN
###U
WNNN
###
NNN
Note 1:
Note 2: Package drawings are not to scale
Note 3: For SOT23 package with date codes before 7B, the bottom line (YMXX) is marked on the bottom side and there is no Country of Assembly (
designates pin 1
@) mark on the top line.
Catalog Number Truncation
AT24C32D
Truncation Code ###: 32D / ##: BD
Date Codes
Voltages
YY = Year
16: 2016
17: 2017
18: 2018
19: 2019
Y = Year
6: 2016
7: 2017
8: 2018
9: 2019
WW = Work Week of Assembly
% = Minimum Voltage
M: 1.7V min
20: 2020
21: 2021
22: 2022
23: 2023
0: 2020
1: 2021
2: 2022
3: 2023
02: Week 2
04: Week 4
...
52: Week 52
Country of Origin
Device Grade
H or U: Industrial Grade
Atmel Truncation
CO = Country of Origin
AT: Atmel
ATM: Atmel
ATML: Atmel
Trace Code
NNN = Alphanumeric Trace Code (2 Characters for Small Packages)
DS20006047A-page 24
Datasheet
© 2018 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
