93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
E1
p
D
2
B
n
1
α
A
c
φ
A1
(F)
β
A2
L
8
Number of Pins
Pitch
.026 BSC
A
.043
Overall Height
-
-
A2
Molded Package Thickness
.030
.033
.037
A1
.000
.006
Standoff
-
E
Overall Width
.193 TYP.
E1
.118 BSC
Molded Package Width
D
.118 BSC
Overall Length
L
.016
.024
.031
Foot Length
Footprint (Reference)
F
.037 REF
φ
0°
-
8°
Foot Angle
c
.003
.006
.009
Lead Thickness
B
.009
.012
.016
Lead Width
α
5°
-
15°
Mold Draft Angle Top
β
5°
-
15°
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Units
Dimension Limits
n
p
MIN
INCHES
NOM
MAX
MIN
MILLIMETERS*
NOM
8
0.65 BSC
-
-
0.75
0.85
-
0.00
4.90 BSC
3.00 BSC
3.00 BSC
0.40
0.60
0.95 REF
0°
-
0.08
-
0.22
-
5°
-
5°
-
MAX
1.10
0.95
0.15
0.80
8°
0.23
0.40
15°
15°
JEDEC Equivalent: MO-187
Drawing No. C04-111
2003 Microchip Technology Inc.
DS21749D-page 13
MICROCHIP [ MICROCHIP TECHNOLOGY ]
