93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
A1
A2
φ
β
L
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.026
0.65
Overall Height
A
.043
1.10
Molded Package Thickness
Standoff
A2
A1
E
.033
.035
.004
.251
.173
.118
.024
4
.037
.006
.256
.177
.122
.028
8
0.85
0.05
0.90
0.10
6.38
4.40
3.00
0.60
4
0.95
0.15
6.50
4.50
3.10
0.70
8
§
.002
.246
.169
.114
.020
0
Overall Width
6.25
4.30
2.90
0.50
0
Molded Package Width
Molded Package Length
Foot Length
E1
D
L
φ
Foot Angle
c
Lead Thickness
.004
.007
0
.006
.010
5
.008
.012
10
0.09
0.19
0
0.15
0.25
5
0.20
0.30
10
Lead Width
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
2003 Microchip Technology Inc.
DS21749D-page 17