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MIC4423CN 参数 Datasheet PDF下载

MIC4423CN图片预览
型号: MIC4423CN
PDF下载: 下载PDF文件 查看货源
内容描述: 双路3A峰值低侧MOSFET驱动器双极/ CMOS / DMOS工艺 [Dual 3A-Peak Low-Side MOSFET Driver Bipolar/CMOS/DMOS Process]
分类和应用: 驱动器接口集成电路光电二极管
文件页数/大小: 12 页 / 120 K
品牌: MICREL [ MICREL SEMICONDUCTOR ]
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MIC4423/4424/4425  
Micrel  
to the ground pin of the driver directly to the ground terminal approximately1.5Vwhichmakesthedriverdirectlycompatible  
of the load. Do not use a twisted pair where the second wire with TTL signals, or with CMOS powered from any supply  
in the pair is the output of the other driver, as this will not voltage between 3V and 15V.  
provide a complete current path for either driver. Likewise, do  
The MIC4423/24/25 drivers can also be driven directly by the  
not use a twisted triad with two outputs and a common return  
SG1524/25/26/27, TL494/95, TL594/95, NE5560/61/62/68,  
unless both of the loads to be driver are mounted extremely  
TSC170, MIC38C42, and similar switch mode power supply  
closetoeachother,andyoucanguaranteethattheywillnever  
ICs. Byrelocatingthemainswitchdrivefunctionintothedriver  
be switching at the same time.  
rather than using the somewhat limited drive capabilities of a  
For output leads on a printed circuit, the general rule is to PWM IC. The PWM IC runs cooler, which generally improves  
makethemasshortandaswideaspossible.Thelandsshould its performance and longevity, and the main switches switch  
also be treated as transmission lines: i.e. minimize sharp faster, which reduces switching losses and increase system  
bends, or narrowings in the land, as these will cause ringing. efficiency.  
For a rough estimate, on a 1.59mm (0.062") thick G-10 PCB  
apairofopposinglandseach2.36mm(0.093")widetranslates  
to a characteristic impedance of about 50. Half that width  
TheinputprotectioncircuitryoftheMIC4423/24/25,inaddition  
to providing 2kV or more of ESD protection, also works to  
preventlatchuporlogicupsetduetoringingorvoltagespiking  
suffices on a 0.787mm (0.031") thick board. For accurate  
on the logic input terminal. In most CMOS devices when the  
impedance matching with a MIC4423/24/25 driver, on a  
logicinputrisesabovethepowersupplyterminal,ordescends  
1.59mm (0.062") board a land width of 42.75mm (1.683")  
below the ground terminal, the device can be destroyed or  
would be required, due to the low impedance of the driver and  
rendered inoperable until the power supply is cycled OFF and  
(usually) its load. This is obviously impractical under most  
ON. The MIC4423/24/25 drivers have been designed to  
circumstances. Generally the tradeoff point between lands  
prevent this. Input voltages excursions as great as 5V below  
and wires comes when lands narrower than 3.18mm (0.125")  
groundwillnotaltertheoperationofthedevice.Inputexcursions  
would be required on a 1.59mm (0.062") board.  
above the power supply voltage will result in the excess  
To obtain minimum delay between the driver and the load, it voltage being conducted to the power supply terminal of the  
is considered best to locate the driver as close as possible to IC. Because the excess voltage is simply conducted to the  
the load (using adequate bypassing). Using matching power terminal, if the input to the driver is left in a high state  
transformers at both ends of a piece of coax, or several when the power supply to the driver is turned off, currents as  
matched lengths of coax between the driver and the load, high as 30mA can be conducted through the driver from the  
works in theory, but is not optimum.  
input terminal to its power supply terminal. This may overload  
the output of whatever is driving the driver, and may cause  
other devices that share the driver’s power supply, as well as  
the driver, to operate when they are assumed to be off, but it  
will not harm the driver itself. Excessive input voltage will also  
slow the driver down, and result in much longer internal  
Driving at Controlled Rates  
Occasionallytherearesituationswhereacontrolledriseorfall  
time (which may be considerably longer than the normal rise  
or fall time of the driver’s output) is desired for a load. In such  
cases it is still prudent to employ best possible practice in  
terms of bypassing, grounding and PCB layout, and then  
reduce the switching speed of the load (NOT the driver) by  
adding a noninductive series resistor of appropriate value  
between the output of the driver and the load. For situations  
where only rise or only fall should be slowed, the resistor can  
be paralleled with a fast diode so that switching in the other  
direction remains fast. Due to the Schmitt-trigger action of the  
driver’s input it is not possible to slow the rate of rise (or fall)  
of the driver’s input signal to achieve slowing of the output.  
propagation delays within the drivers. T , for example, may  
D2  
increase to several hundred nanoseconds. In general, while  
the driver will accept this sort of misuse without damage,  
proper termination of the line feeding the driver so that line  
spiking and ringing are minimized, will always result in faster  
andmorereliableoperationofthedevice, leavelessEMItobe  
filtered elsewhere, be less stressful to other components in  
the circuit, and leave less chance of unintended modes of  
operation.  
Power Dissipation  
Input Stage  
CMOS circuits usually permit the user to ignore power  
dissipation. Logic families such as 4000 series and 74Cxxx  
have outputs which can only source or sink a few milliamps of  
current, and even shorting the output of the device to ground  
The input stage of the MIC4423/24/25 consists of a single-  
MOSFET class A stage with an input capacitance of 38pF.  
This capacitance represents the maximum load from the  
driver that will be seen by its controlling logic. The drain load  
on the input MOSFET is a –2mA current source. Thus, the  
quiescent current drawn by the driver varies, depending on  
the logic state of the input.  
or V  
may not damage the device. CMOS drivers, on the  
CC  
other hand, are intended to source or sink several Amps of  
current. This is necessary in order to drive large capacitive  
loads at frequencies into the megahertz range. Package  
power dissipation of driver ICs can easily be exceeded when  
driving large loads at high frequencies. Care must therefore  
be paid to device dissipation when operating in this domain.  
Following the input stage is a buffer stage which provides  
~400mV of hysteresis for the input, to prevent oscillations  
when slowly-changing input signals are used or when noise is  
present on the input. Input voltage switching threshold is  
The Supply Current vs Frequency and Supply Current vs  
Load characteristic curves furnished with this data sheet aid  
MIC4423/4424/4425  
8
January 1999  
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