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MIC4423CN 参数 Datasheet PDF下载

MIC4423CN图片预览
型号: MIC4423CN
PDF下载: 下载PDF文件 查看货源
内容描述: 双路3A峰值低侧MOSFET驱动器双极/ CMOS / DMOS工艺 [Dual 3A-Peak Low-Side MOSFET Driver Bipolar/CMOS/DMOS Process]
分类和应用: 驱动器接口集成电路光电二极管
文件页数/大小: 12 页 / 120 K
品牌: MICREL [ MICREL SEMICONDUCTOR ]
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MIC4423/4424/4425  
Micrel  
requires attention to the ground path. Two things other than  
the driver affect the rate at which it is possible to turn a load  
off: The adequacy of the grounding available for the driver,  
andtheinductanceoftheleadsfromthedrivertotheload.The  
latter will be discussed in a separate section.  
Application Information  
Although the MIC4423/24/25 drivers have been specifically  
constructed to operate reliably under any practical  
circumstances, there are nonetheless details of usage which  
will provide better operation of the device.  
Best practice for a ground path is obviously a well laid out  
ground plane. However, this is not always practical, and a  
poorly-laidoutgroundplanecanbeworsethannone.Attention  
to the paths taken by return currents even in a ground plane  
isessential. Ingeneral, theleadsfromthedrivertoitsload, the  
drivertothepowersupply,andthedrivertowhateverisdriving  
it should all be as low in resistance and inductance as  
possible. Of the three paths, the ground lead from the driver  
to the logic driving it is most sensitive to resistance or  
inductance, andgroundcurrentfromtheloadarewhatismost  
likelytocausedisruption. Thus, thesegroundpathsshouldbe  
arranged so that they never share a land, or do so for as short  
a distance as is practical.  
Supply Bypassing  
Charging and discharging large capacitive loads quickly  
requires large currents. For example, charging 2000pF from  
0 to 15 volts in 20ns requires a constant current of 1.5A. In  
practice, the charging current is not constant, and will usually  
peak at around 3A. In order to charge the capacitor, the driver  
must be capable of drawing this much current, this quickly,  
from the system power supply. In turn, this means that as far  
as the driver is concerned, the system power supply, as seen  
by the driver, must have a VERY low impedance.  
As a practical matter, this means that the power supply bus  
must be capacitively bypassed at the driver with at least 100X  
the load capacitance in order to achieve optimum driving  
speed. It also implies that the bypassing capacitor must have  
very low internal inductance and resistance at all frequencies  
of interest. Generally, this means using two capacitors, one a  
high-performance low ESR film, the other a low internal  
resistance ceramic, as together the valleys in their two  
impedance curves allow adequate performance over a broad  
enough band to get the job done. PLEASE NOTE that many  
film capacitors can be sufficiently inductive as to be useless  
for this service. Likewise, many multilayer ceramic capacitors  
have unacceptably high internal resistance. Use capacitors  
intended for high pulse current service (in-house we use  
WIMA™ film capacitors and AVX Ramguard™ ceramics;  
severalothermanufacturersofequivalentdevicesalsoexist).  
The high pulse current demands of capacitive drivers also  
mean that the bypass capacitors must be mounted very close  
to the driver in order to prevent the effects of lead inductance  
or PCB land inductance from nullifying what you are trying to  
accomplish. For optimum results the sum of the lengths of the  
leads and the lands from the capacitor body to the driver body  
should total 2.5cm or less.  
To illustrate what can happen, consider the following: The  
inductance of a 2cm long land, 1.59mm (0.062") wide on a  
PCB with no ground plane is approximately 45nH. Assuming  
a dl/dt of 0.3A/ns (which will allow a current of 3A to flow after  
10ns, and is thus slightly slow for our purposes) a voltage of  
13.5 Volts will develop along this land in response to our  
postulated∆Ι. Fora1cmland, (approximately15nH)4.5Volts  
isdeveloped.Eitherway,anyoneusingTTL-levelinputsignals  
to the driver will find that the response of their driver has been  
seriously degraded by a common ground path for input to and  
output from the driver of the given dimensions. Note that this  
is before accounting for any resistive drops in the circuit. The  
resistive drop in a 1.59mm (0.062") land of 2oz. Copper  
carrying 3A will be about 4mV/cm (10mV/in) at DC, and the  
resistance will increase with frequency as skin effect comes  
into play.  
The problem is most obvious in inverting drivers where the  
input and output currents are in phase so that any attempt to  
raisethedriver’sinputvoltage(inordertoturnthedriver’sload  
off) is countered by the voltage developed on the common  
groundpathasthedriverattemptstodowhatitwassupposed  
to. It takes very little common ground path, under these  
circumstances, to alter circuit operation drastically.  
Bypass capacitance, and its close mounting to the driver  
serves two purposes. Not only does it allow optimum  
performance from the driver, it minimizes the amount of lead  
lengthradiatingathighfrequencyduringswitching,(duetothe  
large I) thus minimizing the amount of EMI later available for  
system disruption and subsequent cleanup. It should also be  
noted that the actual frequency of the EMI produced by a  
driver is not the clock frequency at which it is driven, but is  
related to the highest rate of change of current produced  
during switching, a frequency generally one or two orders of  
magnitude higher, and thus more difficult to filter if you let it  
permeateyoursystem.Goodbypassingpracticeisessential  
to proper operation of high speed driver ICs.  
Output Lead Inductance  
The same descriptions just given for PCB land inductance  
apply equally well for the output leads from a driver to its load,  
except that commonly the load is located much further away  
from the driver than the driver’s ground bus.  
Generally, the best way to treat the output lead inductance  
problem, when distances greater than 4cm (2") are involved,  
requires treating the output leads as a transmission line.  
Unfortunately, as both the output impedance of the driver and  
theinputimpedanceoftheMOSFETgateareatleastanorder  
of magnitude lower than the impedance of common coax,  
using coax is seldom a cost-effective solution. A twisted pair  
works about as well, is generally lower in cost, and allows use  
of a wider variety of connectors. The second wire of the  
twisted pair should carry common from as close as possible  
Grounding  
Both proper bypassing and proper grounding are necessary  
for optimum driver operation. Bypassing capacitance only  
allows a driver to turn the load ON. Eventually (except in rare  
circumstances) it is also necessary to turn the load OFF. This  
January 1999  
7
MIC4423/4424/4425  
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