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WF1M32B-100G2UM3 参数 Datasheet PDF下载

WF1M32B-100G2UM3图片预览
型号: WF1M32B-100G2UM3
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash Module, 1MX32, 100ns, CQFP68, 0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68]
分类和应用: 内存集成电路
文件页数/大小: 14 页 / 992 K
品牌: MERCURY [ MERCURY UNITED ELECTRONICS INC ]
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WF1M32B-XXX3  
Document Title  
1Mx32 3.3V NOR FLASH MODULE  
Revision History  
Rev # History  
Release Date Status  
Rev 8  
Changes (Pg. 1-14)  
June 2011  
Final  
8.1 Change document layout from White Electronic Designs to Microsemi  
8.2 Add document Revision History page  
Rev 9  
Changes (Pg. 1, 14)  
August 2011  
April 2012  
Final  
Final  
9.1 Add "NOR" to headline  
Rev 10  
Changes (Pg. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10)  
10.1 Change "in byte mote" to "each chip" in the rst sub-bullet under Sector Architecture  
10.2 Add "#" to WE1-4, CS1-4, OE and RESET in Pin Description on page 2  
10.3 Add (M, Q) to Operation Temperature in Absolute Maximum Ratings chart  
10.4 Add "#" to CS1-4 in Capacitance chart on page 3  
10.5 Delete subhead from DC Characteristics – CMOS Compatible chart  
10.6 Update DC Characteristics – CMOS Compatible chart  
10.7 Update AC Characteristics chart...CS# Controlled  
10.8 Update AC Characteristics chart...WE# Controlled  
10.9 Update AC Characteristics chart...Read-Only Operations  
10.10 Update AC Waveforms For Read Operations diagram  
10.11 Update Write/Erase/Program Operation, WE# Controlled diagram  
10.12 Update AC Waveforms Chip/Sector Erase Operations diagram  
10.13 Update AC Waveforms For Data# Polling During Embedded Algorithm Operations diagram  
10.14 Alternate CS# Controlled Programming Operation Timings  
Rev 11  
Changes (Pg. 1, 3, 12, 13)  
June 2012  
Final  
11.1 Change 66 pin package type from 400 (H1) to 401 (H)  
11.2 Add commercial operating temperature to Recommended Operating Conditions chart  
Rev 12  
Rev 13  
Changes (Pg. 1)  
December 2012  
May 2014  
Final  
Final  
12.1 Delete 1.0mA standby  
Change (Pg. 13)  
13.1 Changed Device Grade "Q" description from "MIL-STD-883 Compliant" to "MIL-PRF-38534 Class H  
Compliant."  
Rev 14  
Change (Pg. 13)  
August 2014  
Final  
14.1 Changed Device Grade "Q" description from "MIL-PRF-38534 Class H  
Compliant" to "Military Grade."  
Rev 15  
Rev 16  
Change (Pg. 12)  
December 2014  
April 2016  
Final  
Final  
15.1 Change 66 pin package type from 401 (H) to 404 (H1)  
Change (Pg. 11) (ECN 9936)  
16.1 Update package dimensions  
Microsemi Corporation reserves the right to change products or specications without notice.  
April 2016 © 2016 Microsemi Corporation. All rights reserved.  
Rev. 16  
14  
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp  
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