WF1M32B-XXX3
ORDERING INFORMATION
W F 1M32 B - XXX X X 3 X
MICROSEMI CORPORATION
FLASH
ORGANIZATION, 1M x 32
User configurable as 2M x 16 or 4M x 8
IMPROVEMENT MARK
B = Boot Block (Bottom Sector)
ACCESS TIME (ns)
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In line Package, HIP (Package 404)
G2U = Ceramic Quad Flat Pack, Low Profile CQFP (Package 510)
DEVICE GRADE:
Q = Military Grade*
M = Military Screened -55°C to +125°C
I = Industrial
-40°C to +85°C
0°C to +70°C
C = Commercial
PROGRAMMING VOLTAGE
3 = 3.3V
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
* This product is processed the same as the 5962-XXXXXHXX product but all
test and mechanical requirements are per the Microsemi data sheet.
Microsemi Corporation reserves the right to change products or specifications without notice.
April 2016 © 2016 Microsemi Corporation. All rights reserved.
Rev. 16
13
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
MERCURY [ MERCURY UNITED ELECTRONICS INC ]
