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WEDPN16M64V-125B2M 参数 Datasheet PDF下载

WEDPN16M64V-125B2M图片预览
型号: WEDPN16M64V-125B2M
PDF下载: 下载PDF文件 查看货源
内容描述: [Synchronous DRAM, 16MX64, 6ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219]
分类和应用: 动态存储器内存集成电路
文件页数/大小: 13 页 / 916 K
品牌: MERCURY [ MERCURY UNITED ELECTRONICS INC ]
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WEDPN16M64V-XB2X  
PRELIMINARY  
TRUTH TABLE — COMMANDS AND DQM OPERATION (NOTE 1)  
NAME (FUNCTION)  
CS#  
H
L
RAS#  
CAS#  
WE#  
X
DQM  
X
ADDR  
I/Os  
COMMAND INHIBIT (NOP)  
X
H
L
X
H
H
L
X
X
X
NO OPERATION (NOP)  
H
H
H
L
X
X
ACTIVE (Select bank and activate row) ( 3)  
READ (Select bank and column, and start READ burst) (4)  
WRITE (Select bank and column, and start WRITE burst) (4)  
BURST TERMINATE  
L
X
Bank/Row  
X
L
H
H
H
L
L/H 8  
L/H 8  
X
Bank/Col  
X
L
L
Bank/Col  
Valid  
Active  
X
L
H
H
L
L
X
PRECHARGE (Deactivate row in bank or banks) ( 5)  
AUTO REFRESH or SELF REFRESH (Enter self refresh mode) (6, 7)  
LOAD MODE REGISTER (2)  
L
L
X
Code  
L
L
H
L
X
X
X
L
L
L
X
Op-Code  
X
Write Enable/Output Enable (8)  
L
Active  
High-Z  
Write Inhibit/Output High-Z (8)  
H
NOTES:  
1. CKE is HIGH for all commands shown except SELF REFRESH.  
2. A0-11 dene the op-code written to the Mode Register and A12 should be driven low.  
3. A0-12 provide row address, and BA0, BA1 determine which bank is made active.  
4. A0-8 provide column address; A10 HIGH enables the auto precharge feature (nonpersistent),  
6. This command is AUTO REFRESH if CKE is HIGH; SELF REFRESH if CKE is LOW.  
7. Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t Care” except for  
CKE.  
8. Activates or deactivates the I/Os during WRITEs (zero-clock delay) and READs (two-clock  
delay).  
while A10 LOW disables the auto precharge feature; BA0, BA1 determine which bank is being  
read from or written to.  
5. A10 LOW: BA0, BA1 determine the bank being precharged. A10 HIGH: All banks precharged  
and BA0, BA1 are “Don’t Care.”  
addressed with the READ or WRITE command is automatically  
performed upon completion of the READ or WRITE burst, except  
in the full-page burst mode, where AUTO PRECHARGE does  
not apply. AUTO PRECHARGE is nonpersistent in that it is either  
enabled or disabled for each individual READ or WRITE command.  
REFRESH command will meet the refresh requirement and ensure  
that each row is refreshed. Alternatively, 8,192 AUTO REFRESH  
commands can be issued in a burst at the minimum cycle rate  
(tRC), once every refresh period (tREF).  
SELF REFRESH*  
AUTO PRECHARGE ensures that the precharge is initiated at  
the earliest valid stage within a burst. The user must not issue  
The SELF REFRESH command can be used to retain data in the  
SDRAM, even if the rest of the system is powered down. When in  
the self refresh mode, the SDRAM retains data without external  
clocking. The SELF REFRESH command is initiated like anAUTO  
REFRESH command except CKE is disabled (LOW). Once the  
SELF REFRESH command is registered, all the inputs to the  
SDRAM become “Don’t Care,” with the exception of CKE, which  
must remain LOW.  
another command to the same bank until the precharge time (tRP  
is completed. This is determined as if an explicit PRECHARGE  
command was issued at the earliest possible time.  
)
BURST TERMINATE  
The BURST TERMINATE command is used to truncate either  
xed-length or full-page bursts. The most recently registered READ  
or WRITE command prior to the BURST TERMINATE command  
will be truncated.  
Once self refresh mode is engaged, the SDRAM provides its own  
internal clocking, causing it to perform its own AUTO REFRESH  
cycles. The SDRAM must remain in self refresh mode for a  
minimum period equal to tRAS and may remain in self refresh  
mode for an indenite period beyond that.  
AUTO REFRESH  
AUTO REFRESH is used during normal operation of the SDRAM  
and is analagous to CAS#-BEFORE-RAS# (CBR) REFRESH in  
conventional DRAMs. This command is nonpersistent, so it must  
be issued each time a refresh is required. All active banks must  
be precharged prior to issuing an AUTO REFRESH command.  
The AUTO REFRESH command should not be issued until the  
minimum tRP has been met after the PRECHARGE command as  
shown in the operations section.  
The procedure for exiting self refresh requires a sequence of  
commands. First, CLK must be stable (stable clock is dened as a  
signal cycling within timing constraints specied for the clock pin)  
prior to CKE going back HIGH. Once CKE is HIGH, the SDRAM  
must have NOP commands issued (a minimum of two clocks) for  
t
XSR, because time is required for the completion of any internal  
refresh in progress.  
Upon exiting the self refresh mode, AUTO REFRESH commands  
must be issued as both SELF REFRESH and AUTO REFRESH  
utilize the row refresh counter.  
The addressing is generated by the internal refresh controller. This  
makes the address bits “Don’t Care” during an AUTO REFRESH  
command. Each 256Mb SDRAM requires 8,192AUTO REFRESH  
cycles every refresh period (tREF). Providing a distributed AUTO  
* Self refresh available in commercial and industrial temperatures only.  
Microsemi Corporation reserves the right to change products or specications without notice.  
July 2011 © 2011 Microsemi Corporation. All rights reserved.  
Rev. 1  
7
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp