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W3E32M64S-266SBI 参数 Datasheet PDF下载

W3E32M64S-266SBI图片预览
型号: W3E32M64S-266SBI
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 32MX64, 0.75ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 18 页 / 648 K
品牌: MERCURY [ MERCURY UNITED ELECTRONICS INC ]
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W3E32M64S-XSBX  
White Electronic Designs  
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CHARACTERISTICS  
(Notes 1-5, 14-17, 33)  
333 Mbs CL 3 (53) 266 Mbs CL 2.5  
266 Mbs CL2.5 200 Mbs CL2  
250 Mbs CL2.5  
200 Mbs CL2  
200 Mbs CL2.5  
150 Mbs CL2  
Parameter  
Symbol  
tAC  
tCH  
Min  
-0.70  
0.45  
0.45  
6
Max  
+0.70  
0.55  
0.55  
13  
Min  
-0.75  
0.45  
0.45  
Max  
+0.75  
0.55  
Min  
-0.8  
0.45  
0.45  
Max  
+0.8  
0.55  
0.55  
Min  
-0.8  
0.45  
0.45  
Max  
+0.8  
0.55  
0.55  
Units  
ns  
tCK  
tCK  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tCK  
tCK  
ns  
tCK  
tCK  
tCK  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tCK  
tCK  
ns  
tCK  
ns  
tCK  
ns  
tCK  
ns  
μs  
Access window of DQs from CLK/CLK#  
CLK high-level width (30)  
CLK low-level width (30)  
tCL  
0.55  
CL = 3 (45, 51, 53)  
CL = 2.5 (45, 51)  
CL = 2 (45, 51)  
tCK (3)  
tCK (2.5)  
tCK (2)  
tDH  
7.5  
10  
13  
13  
7.5  
10  
13  
13  
8
10  
13  
13  
10  
13  
13  
15  
Clock cycle time  
DQ and DM input hold time relative to DQS (26, 31)  
0.45  
0.45  
1.75  
-0.6  
0.35  
0.35  
0.5  
0.5  
1.75  
-0.75  
0.35  
0.35  
0.6  
0.6  
2
-0.8  
0.35  
0.35  
0.6  
0.6  
2
-0.8  
0.35  
0.35  
DQ and DM input setup time relative to DQS (26, 31)  
DQ and DM input pulse width (for each input) (31)  
Access window of DQS from CLK/CLK#  
DQS input high pulse width  
tDS  
tDIPW  
tDQSCK  
tDQSH  
tDQSL  
tDQSQ  
tDQSS  
tDSS  
tDSH  
tHP  
tHZ  
+0.6  
+0.75  
+0.8  
+0.8  
DQS input low pulse width  
DQS-DQ skew, DQS to last DQ valid, per group, per access (25, 26)  
Write command to rst DQS latching transition  
DQS falling edge to CLK rising - setup time  
DQS falling edge from CLK rising - hold time  
Half clock period (34)  
Data-out high-impedance window from CLK/CLK# (18, 42)  
Data-out low-impedance window from CLK/CLK# (18, 42)  
Address and control input hold time (fast slew rate)  
Address and control input setup time (fast slew rate)  
Address and control input hold time (slow slew rate) (14)  
Address and control input setup time (slow slew rate) (14)  
LOAD MODE REGISTER command cycle time  
DQ-DQS hold, DQS to rst DQ to go non-valid, per access (25, 26)  
Data hold skew factor  
ACTIVE to PRECHARGE command (35)  
ACTIVE to READ with Auto precharge command (46)  
ACTIVE to ACTIVE/AUTO REFRESH command period  
AUTO REFRESH command period (49)  
ACTIVE to READ or WRITE delay  
PRECHARGE command period  
DQS read preamble (43)  
DQS read postamble (43)  
ACTIVE bank a to ACTIVE bank b command  
DQS write preamble  
0.45  
1.25  
0.5  
1.25  
0.6  
1.25  
0.6  
1.25  
0.75  
0.2  
0.2  
0.75  
0.2  
0.2  
0.75  
0.2  
0.2  
0.75  
0.2  
0.2  
tCH,tCL  
tCH,tCL  
tCH,tCL  
tCH,tCL  
+0.70  
+0.75  
+0.8  
+0.8  
tLZ  
-0.70  
0.75  
0.75  
0.8  
0.8  
12  
tHP-tQHS  
0.55  
42  
15  
60  
72  
15  
-0.75  
0.90  
0.90  
1
1
15  
-0.8  
1.1  
1.1  
1.1  
1.1  
-0.8  
1.1  
1.1  
1.1  
1.1  
tIH  
F
tIS  
F
tIH  
S
tIS  
S
tMRD  
tQH  
tQHS  
tRAS  
tRAP  
tRC  
tRFC  
tRCD  
tRP  
tRPRE  
tRPST  
tRRD  
tWPRE  
tWPRES  
tWPST  
tWR  
16  
tHP-tQHS  
16  
tHP-tQHS  
tHP-tQHS  
0.75  
120,000  
1
1
70,000  
40  
20  
65  
75  
20  
20  
0.9  
0.4  
15  
0.25  
0
40  
20  
70  
80  
20  
20  
0.9  
0.4  
15  
0.25  
0
120,000  
40  
20  
70  
80  
20  
20  
0.9  
0.4  
15  
0.25  
0
120,000  
15  
0.9  
0.4  
12  
0.25  
0
0.4  
15  
1
1.1  
0.6  
1.1  
0.6  
1.1  
0.6  
1.1  
0.6  
DQS write preamble setup time (20, 21)  
DQS write postamble (19)  
Write recovery time  
Internal WRITE to READ command delay  
Data valid output window (25)  
REFRESH to REFRESH command interval (23) (commercial and  
Industrial)  
0.6  
0.4  
15  
1
0.6  
0.4  
15  
1
0.6  
0.4  
15  
1
0.6  
tWTR  
NA  
tREFC  
tQH - tDQSQ  
tQH - tDQSQ  
tQH - tDQSQ  
tQH - tDQSQ  
70.3  
70.3  
70.3  
70.3  
REFRESH to REFRESH command interval (Military temperature)  
Average periodic refresh interval (23) (commercial and Industrial)  
Average periodic refresh interval (Military temperature)  
Terminating voltage delay to VDD  
tREFC  
tREFI  
tREFI  
tVTD  
35  
7.8  
3.9  
35  
7.8  
3.9  
35  
7.8  
3.9  
35  
7.8  
3.9  
μs  
μs  
μs  
ns  
0
0
0
0
Exit SELF REFRESH to non-READ command  
Exit SELF REFRESH to READ command  
tXSNR  
tXSRD  
75  
200  
75  
200  
80  
200  
80  
200  
ns  
tCK  
January 2008  
Rev. 6  
12  
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
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