+2 .7 V t o +5 .2 5 V, Lo w -P o w e r, 4 -Ch a n n e l,
S e ria l 1 0 -Bit ADCs in QS OP -1 6
8/MAX1249
CS
SCLK
DIN
START SEL2
SEL1
SEL0 UNI/BIP SGL/DIF PD1
PD0
HIGH
IMPEDANCE
SSTRB
HIGH
IMPEDANCE
B0
LSB
DOUT
MSB
B8
S1
S0
Figure 21. TMS320 Serial-Interface Timing Diagram
___________________________________________Ord e rin g In fo rm a t io n (c o n t in u e d )
INL
(LSB)
INL
(LSB)
PART†
TEMP. RANGE
PIN-PACKAGE
PART†
TEMP. RANGE PIN-PACKAGE
MAX1248AEPE -40°C to +85°C
MAX1248BEPE -40°C to +85°C
MAX1248AEEE -40°C to +85°C
MAX1248BEEE -40°C to +85°C
16 Plastic DIP
16 Plastic DIP
16 QSOP
±1/2
±1
MAX1249ACEE
MAX1249BCEE
0°C to +70°C
0°C to +70°C
16 QSOP
±1/2
±1
16 QSOP
MAX1249AEPE -40°C to +85°C
MAX1249BEPE -40°C to +85°C
MAX1249AEEE -40°C to +85°C
MAX1249BEEE -40°C to +85°C
16 Plastic DIP
16 Plastic DIP
16 QSOP
±1/2
±1
±1/2
±1
16 QSOP
MAX1248AMJE -55°C to +125°C 16 CERDIP*
MAX1248BMJE -55°C to +125°C 16 CERDIP*
±1/2
±1
±1/2
±1
16 QSOP
MAX1249ACPE
0°C to +70°C
0°C to +70°C
16 Plastic DIP
16 Plastic DIP
±1/2
±1
MAX1249AMJE -55°C to +125°C 16 CERDIP*
MAX1249BMJE -55°C to +125°C 16 CERDIP*
±1/2
±1
MAX1249BCPE
†
Contact factory for availability of alternate surface-mount packages.
* Contact factory for availability of CERDIP package, and for processing to MIL-STD-883B.
______________________________________________________________________________________ 21
MAXIM [ MAXIM INTEGRATED PRODUCTS ]
