欢迎访问ic37.com |
会员登录 免费注册
发布采购

MAS9270CTG1 参数 Datasheet PDF下载

MAS9270CTG1图片预览
型号: MAS9270CTG1
PDF下载: 下载PDF文件 查看货源
内容描述: 集成电路10.00 - 30.00 MHz的VCTCXO [IC FOR 10.00 - 30.00 MHz VCTCXO]
分类和应用: 石英晶振温度补偿晶振
文件页数/大小: 9 页 / 129 K
品牌: MAS [ MICRO ANALOG SYSTEMS ]
 浏览型号MAS9270CTG1的Datasheet PDF文件第1页浏览型号MAS9270CTG1的Datasheet PDF文件第2页浏览型号MAS9270CTG1的Datasheet PDF文件第3页浏览型号MAS9270CTG1的Datasheet PDF文件第4页浏览型号MAS9270CTG1的Datasheet PDF文件第5页浏览型号MAS9270CTG1的Datasheet PDF文件第7页浏览型号MAS9270CTG1的Datasheet PDF文件第8页浏览型号MAS9270CTG1的Datasheet PDF文件第9页  
DA9270.008  
11 September 2006  
SOLDERING INFORMATION  
N For Sn/Pb MSOP-10  
Resistance to Soldering Heat  
Maximum Temperature  
Maximum Number of Reflow Cycles  
Reflow profile  
According to RSH test IEC 68-2-58/20 2*220°C  
240°C  
2
Thermal profile parameters stated in JESD22-A113 should not  
be exceeded. http://www.jedec.org  
max 0.08 mm  
Seating Plane Co-planarity  
Lead Finish  
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%  
N For Pb Free, RoHS Compliant MSOP-10  
Resistance to Soldering Heat  
Maximum Temperature  
Maximum Number of Reflow Cycles  
Reflow profile  
According to RSH test IEC 68-2-58/20  
260°C  
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020  
should not be exceeded. http://www.jedec.org  
Solder plate 7.62 - 25.4 µm, material Matte Tin  
Lead Finish  
6 (9)