DA9270.008
11 September 2006
PACKAGE (MSOP-10) OUTLINE
e
S
See Detail A
c
c1
B
B
b1
E1
E1
(b)
Section B - B
E
E
5-15 Degrees
L1
Detail A
Land
Pattern
Recommendation
F
A2A
AA
Gauge Plane
Seating Plane
A1
0 - 8 Degrees
L2
D
N
L
G
M
Symbol
Min
Nom
Max
Unit
A
A1
A2
b
b1
c
c1
D
E
E1
e
F
G
L
--
--
--
0.85
--
1.10
0.15
0.95
0.30
0.25
0.23
0.18
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
0.00
0.75
0.15
0.15
0.08
0.08
---
3.00 BSC
4.90 BSC
3.00 BSC
0.50 BSC
4.8
0.50
0.60
0.40
0.80
(Terminal length for
soldering)
L1
L2
M
N
0.95 REF
0.25 BSC
0.41
mm
mm
mm
Mm
1.02
0.50
S
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
Reference Standard : JEDEC MO-187 BA.
5 (9)
MAS [ MICRO ANALOG SYSTEMS ]
