DA9270.008
11 September 2006
PIN DESCRIPTION
Pin Description
Symbol
x-coordinate
y-coordinate
Power Supply Voltage
Programming Input
Serial Bus Clock Input
VDD
PV
166
420
979
1430
1435
1441
CLK
Serial Bus Data Input
Temperature Output
Test Multiplexer Output
Voltage Control Input
Crystal Oscillator Output
Crystal/Varactor Oscillator Input
Power Supply Ground
Buffer Output
DA
TE1
TE2
VC
1234
1488
1742
185
1441
1441
1441
153
X1
439
149
X2
1357
1790
2046
149
VSS
OUT
166
153
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Min
Max
Unit
Note
Supply Voltage
VDD - VSS
-0.3
6.0
VDD + 0.3
20
V
V
Input Pin Voltage
VSS -0.3
1)
Power Dissipation
PMAX
TST
mW
oC
Storage Temperature
Note 1: Not valid for programming pin PV
-55
150
RECOMMENDED OPERATION CONDITIONS
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Note
Supply Voltage
VDD
ICC
2.7
2.8
5.5
1.8
V
mA
oC
oC
1)
Supply Current
Vdd = 2.8 Volt
Operating Temperature
Storage Temperature
TOP
TS
-30
-45
+85
+40
2)
Relative humidity =
15%…70%
Crystal Pulling Sensitivity
Crystal Load Capacitance
S
30
10
ppm/pF
pF
CL
Note 1: Minimum Supply Voltage 2.6 V for MAS9270Cxx2 version.
Note 2: Minimum Operating Temperature –40 °C for MAS9270Cxx3 version.
2 (9)
MAS [ MICRO ANALOG SYSTEMS ]
