MV78100
Hardware Specifications
9.3
Thermal Power Dissipation (Preliminary)
.
Table 25: Thermal Power Dissipation
Interface
Symbol
Test Conditions
Typ
1200
2100
90
Units
mW
Core
P
VDD
Embedded CPU
P
P
P
P
1 GHz, VDD_CPU=1.1V
One Port, VDD_GE=1.8V
M_CLK=333 MHz
mW
VDD_CPU
VDD_GE
VDD_M
MISC
RGMII 1.8V interface
DDR2 DIMM interface (72-bit) ODT
mW
1675
300
mW
Miscellaneous
mW
(Device Bus interface, TWSI, JTAG, MPP,
SPI, UART)
PCI Express interface
P
For one PCI Express interface in x4
mode
400
mW
PEX
USB interface
SATA interface
P
P
For one USB port
For one SATA port
70
mW
mW
USB
180
SATA
Notes:
1. The values are for nominal voltage.
2. Trace load is 5 pF unless otherwise specified.
3. Power in mW is calculated using the typical recommended VDDIO specification for each power
rail.
MV-S104552-U0 Rev. D
Page 64
Copyright © 2008 Marvell
Document Classification: Proprietary Information
December 6, 2008, Preliminary