LF9502
DEVICES INCORPORATED
2K Programmable Line Buffer
NOTES
9. AC specifications are tested with
input transition times less than 3 ns,
output reference levels of 1.5 V (except
t
DIS
test), and input levels of nominally
0 to 3.0 V. Output loading may be a
resistive divider which provides for
specified
I
OH
and
I
OL
at an output
voltage of
V
OH
min and
V
OL
max
2. The products described by this spec- respectively. Alternatively, a diode
ification include internal circuitry de- bridge with upper and lower current
signed to protect the chip from damag-
sources of
I
OH
and
I
OL
respectively,
ing substrate injection currents and ac- and a balancing voltage of 1.5 V may be
cumulations of static charge. Neverthe- used. Parasitic capacitance is 30 pF
less, conventional precautions should minimum, and may be distributed.
be observed during storage, handling,
and use of these circuits in order to This device has high-speed outputs ca-
avoid exposure to excessive electrical pable of large instantaneous current
stress values.
pulses and fast turn-on/turn-off times.
As a result, care must be exercised in the
3. This device provides hard clamping of testing of this device. The following
transient undershoot and overshoot. In- measures are recommended:
put levels below ground or above
V
CC
will be clamped beginning at –0.6 V and a. A 0.1 µF ceramic capacitor should be
V
CC
+ 0.6 V. The device can withstand installed between
V
CC
and Ground
indefinite operation with inputs in the leads as close to the Device Under Test
range of –0.5 V to +7.0 V. Device opera- (DUT) as possible. Similar capacitors
tion will not be adversely affected, how- should be installed between device
V
CC
ever, input current levels will be well in and the tester common, and device
ground and tester common.
excess of 100 mA.
4. Actual test conditions may vary from b. Ground and
V
CC
supply planes
those designated but operation is guar- must be brought directly to the DUT
anteed as specified.
socket or contactor fingers.
5. Supply current for a given applica- c. Input voltages should be adjusted to
tion can be accurately approximated by: compensate for inductive ground and
V
CC
noise to maintain required DUT input
NCV
2
F
levels relative to the DUT ground pin.
4
where
10. Each parameter is shown as a min-
N = total number of device outputs
C = capacitive load per output
V = supply voltage
F = clock frequency
6. Tested with all outputs changing ev-
ery cycle and no load, at a 25 MHz clock
rate.
7. Tested with all inputs within 0.1 V of
V
CC
or Ground, no load.
8. These parameters are guaranteed
but not 100% tested.
imum or maximum value. Input re-
quirements are specified from the point
of view of the external system driving
the chip. Setup time, for example, is
specified as a minimum since the exter-
nal system must supply at least that
much time to meet the worst-case re-
quirements of all parts. Responses from
the internal circuitry are specified from
the point of view of the device. Output
delay, for example, is specified as a
maximum since worst-case operation of
any device always provides data within
that time.
1. Maximum Ratings indicate stress
specifications only. Functional oper-
ation of these products at values beyond
those indicated in the Operating Condi-
tions table is not implied. Exposure to
maximum rating conditions for ex-
tended periods may affect reliability.
11. For the
t
ENA
test, the transition is
measured to the 1.5 V crossing point
with datasheet loads. For the
t
DIS
test,
the transition is measured to the
±200mV level from the measured
steady-state output voltage with
±10mA loads. The balancing volt-
age, V
TH
, is set at 3.5 V for Z-to-0
and 0-to-Z tests, and set at 0 V for Z-
to-1 and 1-to-Z tests.
12. These parameters are only tested at
the high temperature extreme, which is
the worst case for leakage current.
F
IGURE
A. O
UTPUT
L
OADING
C
IRCUIT
DUT
S1
I
OL
C
L
I
OH
V
TH
F
IGURE
B. T
HRESHOLD
L
EVELS
t
ENA
OE
Z
0
1.5 V
1.5 V
1.5 V
t
DIS
3.5V Vth
V
OL
*
0.2 V
0
1
Z
Z
1.5 V
V
OH
*
0.2 V
Z
1
0V Vth
V
OL
* Measured V
OL
with I
OH
= –10mA and I
OL
= 10mA
V
OH
* Measured V
OH
with I
OH
= –10mA and I
OL
= 10mA
Video Imaging Products
6
08/16/2000–LDS.9502-G
LOGIC [ LOGIC DEVICES INCORPORATED ]
