LTC6820
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MS Package
16-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1669 Rev Ø)
0.889 ±0.127
(.035 ±.005)
5.23
3.20 – 3.45
(.206)
(.126 – .136)
MIN
4.039 ±0.102
(.159 ±.004)
(NOTE 3)
0.50
(.0197)
BSC
0.305 ±0.038
(.0120 ±.0015)
TYP
0.280 ±0.076
(.011 ±.003)
REF
16151413121110
9
RECOMMENDED SOLDER PAD LAYOUT
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
DETAIL “A”
0.254
4.90 ±0.152
(.193 ±.006)
(.010)
0° – 6° TYP
GAUGE PLANE
0.53 ±0.152
(.021 ±.006)
1 2 3 4 5 6 7 8
0.86
(.034)
REF
1.10
(.043)
MAX
DETAIL “A”
0.18
(.007)
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
TYP
0.1016 ±0.0508
(.004 ±.002)
MSOP (MS16) 1107 REV Ø
0.50
(.0197)
BSC
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6820f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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