LTC6820
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1700 Rev A)
Exposed Pad Variation AA
0.70 ±0.05
3.50 ±0.05
2.10 ±0.05
1.65 ±0.05
(4 SIDES)
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
R = 0.115
TYP
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
15 16
PIN 1
TOP MARK
(NOTE 6)
0.40 ±0.10
1
2
1.65 ±0.10
(4-SIDES)
(UD16 VAR A) QFN 1207 REV A
0.200 REF
0.25 ±0.05
0.50 BSC
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-4)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
6820f
26
Linear [ Linear ]
