LT3681
PACKAGE DESCRIPTION
DE14MA Package
14-Lead Plastic DFN, Multichip (4mm × 3mm)
(Reference LTC DWG # 05-08-1731 Rev 0)
1.78 0.05
0.70 0.05
0.10 TYP
3.50 0.05
0.51 TYP
1.65 0.05
1.65 0.05
1.07
0.05
2.10 0.05
PACKAGE
OUTLINE
0.25 0.05
0.50 BSC
3.00 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
R = 0.115
TYP
8
4.00 0.10
(2 SIDES)
1.78 0.10
14
R = 0.05
TYP
1.07
0.10
0.10 TYP
0.51 TYP
3.00 0.10
(2 SIDES)
1.65 0.10
0.40 0.10
1.65 0.10
PIN 1
TOP MARK
(SEE NOTE 6)
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
7
1
0.25 0.05
0.50 BSC
0.75 0.05
0.200 REF
(DE14MA) DFN 1106 REV Ø
3.00 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3681f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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Linear [ Linear ]
