LTC3412
U
PACKAGE DESCRIPTIO
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BA
4.90 – 5.10*
(.193 – .201)
2.74
(.108)
2.74
(.108)
16 1514 13 12 1110
9
6.60 ±0.10
4.50 ±0.10
2.74
(.108)
6.40
(.252)
BSC
SEE NOTE 4
2.74
(.108)
0.45 ±0.05
1.05 ±0.10
0.65 BSC
5
7
8
1
2
3
4
6
RECOMMENDED SOLDER PAD LAYOUT
1.10
(.0433)
MAX
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
0.65
(.0256)
BSC
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
0.05 – 0.15
(.002 – .006)
0.195 – 0.30
FE16 (BA) TSSOP 0204
(.0077 – .0118)
TYP
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
MILLIMETERS
(INCHES)
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
UF Package
16-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1692)
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH R = 0.20 TYP
OR 0.35 × 45° CHAMFER
0.75 ± 0.05
R = 0.115
TYP
4.00 ± 0.10
(4 SIDES)
15
16
0.72 ±0.05
0.55 ± 0.20
PIN 1
TOP MARK
(NOTE 6)
1
2
2.15 ± 0.05
2.15 ± 0.10
(4-SIDES)
(4 SIDES)
4.35 ± 0.05
2.90 ± 0.05
PACKAGE
OUTLINE
(UF16) QFN 1004
0.200 REF
0.30 ± 0.05
0.65 BSC
0.30 ±0.05
0.65 BSC
0.00 – 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. DRAWING NOT TO SCALE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
3412fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
19
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