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3412IFE 参数 Datasheet PDF下载

3412IFE图片预览
型号: 3412IFE
PDF下载: 下载PDF文件 查看货源
内容描述: 2.5A ,为4MHz ,单片同步降压型稳压器 [2.5A, 4MHz, Monolithic Synchronous Step-Down Regulator]
分类和应用: 稳压器
文件页数/大小: 20 页 / 213 K
品牌: Linear [ Linear ]
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LTC3412  
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APPLICATIO S I FOR ATIO  
The LTC3412 contains an internal soft-start clamp that  
gradually raises the clamp on ITH after the RUN/SS pin is  
pulled above 2V. The full current range becomes available  
on ITH after 1024 switching cycles. If a longer soft-start  
period is desired, the clamp on ITH can be set externally  
with a resistor and capacitor on the RUN/SS pin as shown  
in Figure 1. The soft-start duration can be calculated by  
using the following formula:  
switches. Both the DC bias and gate charge losses are  
proportional to VIN and thus their effects will be more  
pronounced at higher supply voltages.  
2. I2R losses are calculated from the resistances of the  
internal switches, RSW and external inductor RL. In con-  
tinuous mode the average output current flowing through  
inductor L is “chopped” between the main switch and the  
synchronous switch. Thus, the series resistance looking  
into the SW pin is a function of both top and bottom  
MOSFET RDS(ON) and the duty cycle (DC) as follows:  
V
IN  
tSS = RSSCSS ln  
Seconds  
(
)
V 1.8V⎠  
IN  
RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC)  
Efficiency Considerations  
The RDS(ON) for both the top and bottom MOSFETs can be  
obtained from the Typical Performance Characteristics  
curves. Thus, to obtain I2R losses, simply add RSW to RL  
and multiply the result by the square of the average output  
current.  
The efficiency of a switching regulator is equal to the  
output power divided by the input power times 100%. It is  
oftenusefultoanalyzeindividuallossestodeterminewhat  
is limiting the efficiency and which change would produce  
the most improvement. Efficiency can be expressed as:  
Other losses including CIN and COUT ESR dissipative  
losses and inductor core losses generally account for less  
than 2% of the total loss.  
Efficiency = 100% – (L1 + L2 + L3 + ...)  
whereL1, L2, etc. aretheindividuallossesasapercentage  
of input power.  
Thermal Considerations  
Although all dissipative elements in the circuit produce  
losses, two main sources usually account for most of the  
losses: VIN quiescent current and I2R losses.  
In most applications, the LTC3412 does not dissipate  
much heat due to its high efficiency. But, in applications  
where the LTC3412 is running at high ambient tempera-  
ture with low supply voltage and high duty cycles, such as  
in dropout, the heat dissipated may exceed the maximum  
junction temperature of the part. If the junction tempera-  
ture reaches approximately 150°C, both power switches  
will be turned off and the SW node will become high  
impedance.  
The VIN quiescent current loss dominates the efficiency  
loss at very low load currents whereas the I2R loss  
dominates the efficiency loss at medium to high load  
currents. In a typical efficiency plot, the efficiency curve at  
very low load currents can be misleading since the actual  
power lost is of no consequence.  
To avoid the LTC3412 from exceeding the maximum  
junction temperature, the user will need to do some  
thermal analysis. The goal of the thermal analysis is to  
determine whether the power dissipated exceeds the  
maximum junction temperature of the part. The tempera-  
ture rise is given by:  
1. The VIN quiescent current is due to two components:  
theDCbiascurrentasgivenintheelectricalcharacteristics  
and the internal main switch and synchronous switch gate  
charge currents. The gate charge current results from  
switching the gate capacitance of the internal power  
MOSFET switches. Each time the gate is switched from  
high to low to high again, a packet of charge dQ moves  
from VIN to ground. The resulting dQ/dt is the current out  
of VIN that is typically larger than the DC bias current. In  
continuous mode, IGATECHG=f(QT + QB) where QT and QB  
are the gate charges of the internal top and bottom  
TR = (PD)(θJA)  
where PD is the power dissipated by the regulator and θJA  
is the thermal resistance from the junction of the die to the  
ambient temperature.  
3412fb  
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