JAW050A and JAW075A Power Modules; dc-dc Converters:
36 Vdc to 75 Vdc Input, 5 Vdc Output; 50 W to 75 W
Data Sheet
April 2008
General Specifications
Parameter
Calculated MTBF (IO = 80% of IO, max; TC = 40 °C)
Weight
Min
Typ
3,000,000
—
Max
Unit
hours
g (oz.)
—
100 (3.5)
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See the Feature Descriptions section for additional information.
Parameter
Remote On/Off Signal Interface
Symbol
Min
Typ
Max
Unit
(VI = 0 V to 75 V; open collector or equivalent compatible;
signal referenced to VI(–) terminal):
JAWxxxA1 Preferred Logic:
Logic Low—Module On
Logic High—Module Off
JAWxxxA Optional Logic:
Logic Low—Module Off
Logic High—Module On
Logic Low:
At Ion/off = 1.0 mA
At Von/off = 0.0 V
Von/off
Ion/off
0
—
—
—
1.2
1.0
V
mA
Logic High:
At Ion/off = 0.0 µA
Leakage Current
Turn-on Time (See Figure 10.)
(IO = 80% of IO, max; VO within ±1% of steady state)
Von/off
Ion/off
—
—
—
—
—
—
40
15
50
80
V
µA
ms
Output Voltage Adjustment:
Output Voltage Remote-sense Range
Output Voltage Set-point Adjustment Range (trim)
—
—
—
60
—
—
0.5
110
V
%VO, nom
Output Overvoltage Protection
Overtemperature Protection
VO, sd
5.9*
—
—
7.0*
—
V
TC
105
°C
* These are manufacturing test limits. In some situations, results may differ.
Solder, Cleaning, and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to the electrical board testing. The
result of inadequate circuit-board cleaning and drying can affect both the reliability of a power module and the test-
ability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying proce-
dures, refer to the Board-Mounted Power Modules: Soldering and Cleaning Application Note (AP97-021EPS).
4
Lineage Power