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EQW010A0BZ 参数 Datasheet PDF下载

EQW010A0BZ图片预览
型号: EQW010A0BZ
PDF下载: 下载PDF文件 查看货源
内容描述: 36 - 75VDC输入; 1.0到12.0Vdc输出; 10至40A输出电流 [36 - 75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current]
分类和应用:
文件页数/大小: 28 页 / 1172 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
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Data Sheet  
EQW010-040 Series Power Modules  
March 4, 2009  
36 – 75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current  
MSL Rating  
Surface Mount Information (continued)  
Lead Free Soldering  
The EQW010-040 modules have a MSL rating of 1.  
The –Z version of the EQW010-040 modules are  
lead-free (Pb-free) and RoHS compliant and are both  
forward and backward compatible in a Pb-free and a  
SnPb soldering process. Failure to observe the  
instructions below may result in the failure of or cause  
damage to the modules and can adversely affect  
long-term reliability.  
Storage and Handling  
The recommended storage environment and handling  
procedures for moisture-sensitive surface mount  
packages is detailed in J-STD-033 Rev. A (Handling,  
Packing, Shipping and Use of Moisture/Reflow  
Sensitive Surface Mount Devices). Moisture barrier  
bags (MBB) with desiccant are required for MSL  
ratings of 2 or greater. These sealed packages  
should not be broken until time of use. Once the  
original package is broken, the floor life of the product  
at conditions of 30°C and 60% relative humidity  
varies according to the MSL rating (see J-STD-033A).  
The shelf life for dry packed SMT packages will be a  
minimum of 12 months from the bag seal date, when  
stored at the following conditions: < 40° C, < 90%  
relative humidity.  
Pb-free Reflow Profile  
Power Systems will comply with J-STD-020 Rev. C  
(Moisture/Reflow Sensitivity Classification for  
Nonhermetic Solid State Surface Mount Devices) for  
both Pb-free solder profiles and MSL classification  
procedures. This standard provides a recommended  
forced-air-convection reflow profile based on the  
volume and thickness of the package (table 4-2). The  
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).  
The recommended linear reflow profile using  
Sn/Ag/Cu solder is shown in Fig. 69.  
Post Solder Cleaning and Drying  
Considerations  
300  
Per J-STD-020 Rev. C  
Post solder cleaning is usually the final circuit-board  
assembly process prior to electrical board testing. The  
result of inadequate cleaning and drying can affect  
both the reliability of a power module and the  
testability of the finished circuit-board assembly. For  
guidance on appropriate soldering, cleaning and  
drying procedures, refer to Lineage Power Board  
Mounted Power Modules: Soldering and Cleaning  
Application Note (AN04-001).  
Peak Temp 260°C  
250  
Cooling  
200  
Zone  
* Min. Time Above 235°C  
15 Seconds  
150  
Heating Zone  
1°C/Second  
*Time Above 217°C  
60 Seconds  
100  
50  
0
Reflow Time (Seconds)  
Figure 69. Recommended linear reflow profile  
using Sn/Ag/Cu solder.  
LINEAGE POWER  
20  
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