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EQW010A0BZ 参数 Datasheet PDF下载

EQW010A0BZ图片预览
型号: EQW010A0BZ
PDF下载: 下载PDF文件 查看货源
内容描述: 36 - 75VDC输入; 1.0到12.0Vdc输出; 10至40A输出电流 [36 - 75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current]
分类和应用:
文件页数/大小: 28 页 / 1172 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
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Data Sheet  
EQW010-040 Series Power Modules  
March 4, 2009  
36 – 75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current  
Feature Descriptions (continued)  
The voltage between the Vo(+) and Vo(–) terminals  
must not exceed the minimum output overvoltage  
protection value shown in the Feature Specifications  
table. This limit includes any increase in voltage due  
to remote-sense compensation and output voltage  
set-point adjustment trim.  
Although the output voltage can be increased by both  
the remote sense and by the trim, the maximum  
increase for the output voltage is not the sum of both.  
The maximum increase is the larger of either the  
remote sense or the trim. The amount of power  
delivered by the module is defined as the voltage at  
the output terminals multiplied by the output current.  
When using remote sense and trim, the output  
voltage of the module can be increased, which at the  
same output current would increase the power output  
of the module. Care should be taken to ensure that  
the maximum output power of the module remains at  
or below the maximum rated power (Maximum rated  
power = Vo,set x Io,max).  
AIRFLOW  
Figure 64. Tref Temperature Measurement  
Location for Heat plate Module.  
Please refer to the Application Note “Thermal  
Characterization Process For Open-Frame Board-  
Mounted Power Modules” for a detailed discussion of  
thermal aspects including maximum device  
temperatures.  
Thermal Considerations  
The power modules operate in a variety of thermal  
environments; however, sufficient cooling should be  
provided to help ensure reliable operation.  
Through-Hole Soldering Information  
The RoHS-compliant (Z codes) through-hole products  
use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-  
compliant components. The RoHS-compliant with  
lead solder exemption (non-Z codes) through-hole  
products use Sn/Pb solder and RoHS-compliant  
components. Both non-Z and Z codes are designed to  
be processed through single or dual wave soldering  
machines. The pins have an RoHS-compliant finish  
that is compatible with both Pb and Pb-free wave  
soldering processes. A maximum preheat rate of  
3°C/s is suggested. The wave preheat process  
should be such that the temperature of the power  
module board is kept below 210°C. For Pb solder,  
the recommended pot temperature is 260°C, while the  
Pb-free solder pot is 270°C max. Not all RoHS-  
compliant through-hole products can be processed  
with paste-through-hole Pb or Pb-free reflow process.  
If additional information is needed, please consult with  
your Lineage Power representative for more details.  
Considerations include ambient temperature, airflow,  
module power dissipation, and the need for increased  
reliability. A reduction in the operating temperature of  
the module will result in an increase in reliability. The  
thermal data presented here is based on physical  
measurements taken in a wind tunnel.  
The thermal reference point, Tref used in the  
specifications for open frame modules is shown in  
Figure 63. For reliable operation this temperature  
should not exceed 120oC.  
Surface Mount Information  
Pick and Place  
The EQW010-040 modules use an open frame  
construction and are designed for a fully automated  
assembly process. The modules are fitted with a  
label designed to provide a large surface area for pick  
and place operations. The label meets all the  
requirements for surface mount processing, as well as  
safety standards, and is able to withstand reflow  
temperatures of up to 300oC. The label also carries  
product information such as product code, serial  
number and the location of manufacture.  
AIRFLOW  
Figure 63. Tref Temperature Measurement  
Location for open Frame Module.  
The thermal reference point, Tref used in the  
specifications for modules with heat plates (-C or –H)  
is shown in Figure 64. For reliable operation this  
temperature should not exceed 110oC for airflow rates  
below 1.0m/s (200LFM), and should not exceed  
105oC for airflow rates equal to or above 1.0m/s  
(200LFM).  
Surface Mount Information (continued)  
LINEAGE POWER  
18  
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