Data Sheet
EQW010-040 Series Power Modules
March 4, 2009
36 – 75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current
Feature Descriptions (continued)
The voltage between the Vo(+) and Vo(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output
voltage of the module can be increased, which at the
same output current would increase the power output
of the module. Care should be taken to ensure that
the maximum output power of the module remains at
or below the maximum rated power (Maximum rated
power = Vo,set x Io,max).
AIRFLOW
Figure 64. Tref Temperature Measurement
Location for Heat plate Module.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products
use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-
compliant components. The RoHS-compliant with
lead solder exemption (non-Z codes) through-hole
products use Sn/Pb solder and RoHS-compliant
components. Both non-Z and Z codes are designed to
be processed through single or dual wave soldering
machines. The pins have an RoHS-compliant finish
that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of
3°C/s is suggested. The wave preheat process
should be such that the temperature of the power
module board is kept below 210°C. For Pb solder,
the recommended pot temperature is 260°C, while the
Pb-free solder pot is 270°C max. Not all RoHS-
compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process.
If additional information is needed, please consult with
your Lineage Power representative for more details.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference point, Tref used in the
specifications for open frame modules is shown in
Figure 63. For reliable operation this temperature
should not exceed 120oC.
Surface Mount Information
Pick and Place
The EQW010-040 modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
AIRFLOW
Figure 63. Tref Temperature Measurement
Location for open Frame Module.
The thermal reference point, Tref used in the
specifications for modules with heat plates (-C or –H)
is shown in Figure 64. For reliable operation this
temperature should not exceed 110oC for airflow rates
below 1.0m/s (200LFM), and should not exceed
105oC for airflow rates equal to or above 1.0m/s
(200LFM).
Surface Mount Information (continued)
LINEAGE POWER
18
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
