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EQW010A0BZ 参数 Datasheet PDF下载

EQW010A0BZ图片预览
型号: EQW010A0BZ
PDF下载: 下载PDF文件 查看货源
内容描述: 36 - 75VDC输入; 1.0到12.0Vdc输出; 10至40A输出电流 [36 - 75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current]
分类和应用:
文件页数/大小: 28 页 / 1172 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
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Data Sheet  
EQW010-040 Series Power Modules  
March 4, 2009  
36 – 75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current  
soldered using natural forced convection, IR (radiant  
infrared), or a combination of convection/IR.  
The following instructions must be observed when  
SMT soldering these units. Failure to observe these  
instructions may result in the failure of or cause  
damage to the modules, and can adversely affect  
long-term reliability.  
Figure 65. Pick and Place Location.  
Nozzle Recommendations  
Tin Lead Soldering  
The recommended linear reflow profile using Sn/Pb  
solder is shown in Figure 67 and 68. For reliable  
soldering the solder reflow profile should be  
established by accurately measuring the modules CP  
connector temperatures.  
The module weight has been kept to a minimum by  
using open frame construction. Even so, these  
modules have a relatively large mass when compared  
to conventional SMT components. Variables such as  
nozzle size, tip style, vacuum pressure and placement  
speed should be considered to optimize this process.  
The minimum recommended nozzle diameter for  
reliable operation is 6mm. The maximum nozzle outer  
diameter, which will safely fit within the allowable  
component spacing, is 9 mm.  
300  
Peak Temp 235oC  
250  
Cooling  
zone  
1- 4 oCs-1  
Heat zone  
max 4oCs-1  
200  
150  
10 0  
50  
Oblong or oval nozzles up to 11 x 9 mm may also be  
used within the space available.  
Soak zone  
30-240s  
T
lim above  
205oC  
Reflow Soldering Information  
Preheat zone  
max4oCs-1  
The surface mountable modules in the EQW family  
use our newest SMT technology called “Column Pin”  
(CP) connectors. Figure 66 shows the new CP  
connector before and after reflow soldering onto the  
end-board assembly.  
0
REFLOW TIME (S)  
Figure 67. Recommended Reflow Profile for  
Tin/Lead (Sn/Pb) process.  
EQW Board  
240  
235  
230  
225  
220  
215  
210  
205  
200  
Insulator  
Solder Ball  
End assembly PCB  
Figure 66. Column Pin Connector Before and After  
Reflow Soldering.  
The CP is constructed from a solid copper pin with an  
integral solder ball attached, which is composed of  
tin/lead (Sn63/Pb37) solder for non-Z codes, or  
Sn/Ag3.8/Cu0.7 (SAC) solder for –Z codes. The CP  
connector design is able to compensate for large  
amounts of co-planarity and still ensure a reliable  
SMT solder joint. Typically, the eutectic solder melts  
at 183oC (Sn/Pb solder) or 217-218 oC (SAC solder),  
wets the land, and subsequently wicks the device  
connection. Sufficient time must be allowed to fuse  
the plating on the connection to ensure a reliable  
solder joint. There are several types of SMT reflow  
technologies currently used in the industry. These  
surface mount power modules can be reliably  
0
10  
20  
30  
40  
50  
60  
Figure 68. Time Limit, Tlim, Curve Above 205oC for  
Tin/Lead (Sn/Pb) process.  
LINEAGE POWER  
19  
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