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AXA003A0X 参数 Datasheet PDF下载

AXA003A0X图片预览
型号: AXA003A0X
PDF下载: 下载PDF文件 查看货源
内容描述: 8.3 - 14VDC输入; 0.75Vdc至5.5VDC输出; 3A输出电流 [8.3 - 14Vdc Input; 0.75Vdc to 5.5Vdc Output; 3A output current]
分类和应用:
文件页数/大小: 18 页 / 573 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
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Data Sheet  
Austin MiniLynxTM 12V SIP Non-isolated Power Modules:  
March 31, 2008  
8.3 – 14Vdc Input; 0.75Vdc to 5.5Vdc Output; 3A output current  
Thermal Considerations  
Power modules operate in a variety of thermal  
environments; however, sufficient cooling should be  
provided to help ensure reliable operation.  
25.4_  
(1.0)  
Wind Tunnel  
PWBs  
Considerations include ambient temperature, airflow,  
module power dissipation, and the need for increased  
reliability. A reduction in the operating temperature of  
the module will result in an increase in reliability. The  
thermal data presented here is based on physical  
measurements taken in a wind tunnel. The test set-  
up is shown in Figure 32. Note that the airflow is  
parallel to the long axis of the module as shown in  
figure 31. The derating data applies to airflow in  
either direction of the module’s long axis.  
Powe r Mod ule  
76.2_  
(3.0)  
x
Airflow  
Probe Location  
for measuring  
airflow and  
ambient  
5.97_  
(0.235)  
temperature  
Air  
flow  
Figure 32. Thermal Test Set-up.  
Tref1  
Heat Transfer via Convection  
Increased airflow over the module enhances the heat  
transfer via convection. Thermal derating curves  
showing the maximum output current that can be  
delivered by various module versus local ambient  
temperature (TA) for natural convection and up to  
0.5m/s (100 ft./min) are shown in the Characteristics  
Curves section.  
Tref2  
Figure 31. T  
location.  
Temperature measurement  
ref  
The thermal reference point, Tref used in the  
specifications is shown in Figure 32. For reliable  
operation this temperature should not exceed 115oC.  
The output power of the module should not exceed  
the rated power of the module (Vo,set x Io,max).  
Please refer to the Application Note “Thermal  
Characterization Process For Open-Frame Board-  
Mounted Power Modules” for a detailed discussion of  
thermal aspects including maximum device  
temperatures.  
LINEAGE POWER  
14  
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