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ECP2-35 参数 Datasheet PDF下载

ECP2-35图片预览
型号: ECP2-35
PDF下载: 下载PDF文件 查看货源
内容描述: LatticeECP2 / M系列数据表 [LatticeECP2/M Family Data Sheet]
分类和应用:
文件页数/大小: 386 页 / 2475 K
品牌: LATTICE [ LATTICE SEMICONDUCTOR ]
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Architecture  
LatticeECP2/M Family Data Sheet  
Lattice Semiconductor  
Figure 2-32. Output and Tristate Block,Top Edge  
TD  
0
1
TO  
0
Q
D
1
ONEG1  
ONEG0  
D-Type  
/LATCH  
Tristate Logic  
DO  
0
1
Q
D
D-Type  
/LATCH  
ECLK1  
0
ECLK2  
Output Logic  
CLK1  
1
(CLKA)  
Note: Simplified version does not show CE and SET/RESET details.  
Tristate Register Block  
The tristate register block provides the ability to register tri-state control signals from the core of the device before  
they are passed to the sysI/O buffers. The block contains a register for SDR operation and an additional latch for  
DDR operation. Figure 2-31 shows the diagram of the Tristate Register Block with the Output Block for the left, right  
and bottom edges and Figure 2-32 shows the diagram of the Tristate Register Block with the Output Block for the  
top edge.  
In SDR mode, ONEG1 feeds one of the flip-flops that then feeds the output. The flip-flop can be configured a D-  
type or latch. In DDR mode, ONEG1 and OPOS1 are fed into registers on the positive edge of the clock. Then in  
the next clock the registered OPOS1 is latched. A multiplexer running off the same clock cycle selects the correct  
register for feeding to the output (D0).  
Control Logic Block  
The control logic block allows the selection and modification of control signals for use in the PIO block. A clock is  
selected from one of the clock signals provided from the general purpose routing, one of the edge clocks (ECLK1/  
ECLK2) and a DQS signal provided from the programmable DQS pin and provided to the input register block. The  
clock can optionally be inverted.  
DDR Memory Support  
Certain PICs have additional circuitry to allow the implementation of high speed source synchronous and DDR  
memory interfaces. The support varies by the edge of the device as detailed below.  
Left and Right Edges  
PICs on these edges have registered elements that support DDR memory interfaces. One of every 16 PIOs con-  
tains a delay element to facilitate the generation of DQS signals.The DQS signal feeds the DQS bus that spans the  
set of 16 PIOs. Figure 2-33 shows the assignment of DQS pins in each set of 16 PIOs.  
Bottom Edge  
PICs on the bottom edge have registered elements that support DDR memory interfaces. One of every 18 PIOs  
contains a delay element to facilitate the generation of DQS signals.The DQS signal feeds the DQS bus that spans  
the set of 18 PIOs. Figure 2-34 shows the assignment of DQS pins in each set of 18 PIOs.  
2-35  
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