Pinout Information
LatticeECP2/M Family Data Sheet
Lattice Semiconductor
LatticeECP2M Power Supply and NC
Signal
256 fpBGA
484 fpBGA
V
G7, G9, H7, J10, K10, K8
J10, J11, J12, J13, K14, K9, L14, L9, M14, M9, N14,
N9, P10, P11, P12, P13
CC
V
V
V
V
V
V
V
V
V
V
V
V
E7
B5, B9, E7, H9
CCIO0
CCIO1
CCIO2
CCIO3
CCIO4
CCIO5
CCIO6
CCIO7
CCIO8
CCJ
E10
D13, E16, H14
E14, G12
K12, M14
M10, P12
M7, P5
K5, M3
E3, G5
T15
E21, G18, J15, K19
N19, P15, T18, V21
AA18, R14, V16, W13
AA5, R9, V7, W10
N4, P8, T5, V2
E2, G5, J8, K4
AA22, U19
K7
W4
G8, H10, J7, K9
G10
H11, H12, L15, L8, M15, M8, R11, R12
R8, H15, H8, R15
CCAUX
CCPLL
SERDES Power3
C15, B15, C12, A12, C11, C10, C14, C13, B9, C22, B22, C19, A19, C18, C17, C21, C20, B16, C16,
C9, C5, C4, C8, C7, A6, C6, B3, C3
C12, C11, C15, C14, A13, C13, B10, C10
GND1
A1, A15, A16, A3, A9, B12, B6, E15, E2, H14,
H8, H9, J3, J8, J9, M15, M2, P9, R12, R5, T1,
T16
A1, A10, A16, A22, AA19, AA4, AB1, AB22, B13,
B19, B4, D16, D2, D21, D7, G19, G4, H10, H13, J14,
J9, K10, K11, K12, K13, K15, K20, K3, K8, L10, L11,
L12, L13, M10, M11, M12, M13, N10, N11, N12, N13,
N15, N20, N3, N8, P14, P9, R10, R13, T19, T4, W16,
W2, W21, W7, Y10, Y13
NC2
D10, D11, D12, D13, D14, D4, D5, D6, D7, E11, LFE2M20: D14, D15, E14, E15, F13, F14, F15, G12,
E6, E8, E9, F10, F7, F8, F9
G13, G14, G15
LFE2M35: D14, D15, E14, E15, F13, F14, F15, G12,
G13, G14, G15, U6
LFE2M50:Y15, W15, AB20, AB21, AA20, AB19,
AB18, Y22, Y21, Y17, Y18, Y16, W17, Y19, Y20, W19,
W18, V17, V18, D15, G14, G15, D14, E15, E14, F15,
F14, F13, G12, G13
1. All grounds must be electrically connected at the board level. For fpBGA packages, the total number of GND balls is less than the actual
number of GND logic connections from the die to the common package GND plane.
2. NC pins should not be connected to any active signals, VCC or GND.
3. For package migration across device densities, the designer must comprehend the package pin requirements for the SERDES blocks. Spe-
cifically, the SERDES power pins of the largest density device must be accounted to accommodate migration to other smaller devices using
the same package. Please refer to technical note TN1160, LatticeECP2/M Density Migration, for more details.
4-18
LATTICE [ LATTICE SEMICONDUCTOR ]
