ML13135
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
P DIP 24 = LP
PLASTIC PACKAGE
(ML13135LP)
CASE 724–03
ISSUE D
–A–
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
1
13
–B–
12
4. CONTROLLING DIMENSION: INCH.
INCHES
MILLIMETERS
L
DIM
A
B
C
D
E
F
G
J
K
L
M
N
MIN
MAX
MIN
31.25
6.35
3.69
0.38
MAX
32.13
6.85
4.44
0.51
C
1.230
0.250
0.145
0.015
1.265
0.270
0.175
0.020
NOTE 1
–T–
K
0.050 BSC
1.27 BSC
SEATING
M
N
0.040
0.060
1.02
1.52
PLANE
E
0.100 BSC
2.54 BSC
0.007
0.110
0.012
0.140
0.18
2.80
0.30
3.55
G
F
J 24 PL
M
M
0.25 (0.010)
T
B
0.300 BSC
15
0.040
7.62 BSC
15
0.51 1.01
D 24 PL
0°
°
0
°
°
M
M
0.020
0.25 (0.010)
T
A
SO 24 = -6P
(ML13135-6P)
PLASTIC PACKAGE
CASE 751E–04
ISSUE E
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
24
13
–B–
P 12 PL
M
M
0.010 (0.25)
B
1
12
D 24 PL
MILLIMETERS
INCHES
J
F
DIM
A
B
C
D
F
G
J
K
M
P
MIN
15.25
7.40
2.35
0.35
0.41
MAX
15.54
7.60
2.65
0.49
0.90
MIN
MAX
0.612
0.299
0.104
0.019
0.035
M
S
S
0.010 (0.25)
A
B
T
0.601
0.292
0.093
0.014
0.016
R X 45°
1.27 BSC
0.050 BSC
0.23
0.13
0.32
0.29
0.009
0.005
0.013
0.011
C
0°
8°
0°
8°
10.05
0.25
10.55
0.75
0.395
0.010
0.415
0.029
–T–
SEATING
PLANE
R
M
K
G 22 PL
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-
ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
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