KOA SPEER ELECTRONICS, INC.
SS-227 R2
8. Characteristics Cont.
Item
Requirement
Conditions
Terminal Adhesion
Strength
No physical damage
Solder a chip to a test
substrate and then
laterally apply a
Chip
load (5N, 500gF) in
the arrow direction.
Substrate
Soldering Heat
Resistance
Appearance: No physical damage
Capacitance: Within tolerance
Dielectric Loss: Within tolerance
Insulation Resistance: Within tolerance
Flux: 25% rosin
Pre-heating: 60 sec
Pre-heating Temp: 150°C
Solder: H60A
Solder Temp: 260°C 5°C
Dip Time: 5 0.5 sec
Solderablility
More than 95% of the terminal electrode shall
be covered with new solder.
Flux: 25% rosin
Pre-heating: 60 sec
Pre-heating Temp: 150°C
Solder: H60A
Solder Temp: 230°C 5°C
Dip Time: 4 1 sec
Temperature Cycle
Appearance: No physical damage
Capacitance: Within tolerance
Repeat the following heat cycle 10 times:
Step Temperature
Time
Dielectric Loss: Within tolerance
Insulation Resistance: Within tolerance
1
2
3
4
-40°C 3°C
Room Temp.
85°C 2°C
30 min 3 min
15 min max.
30 min 3 min
15 min max.
Room Temp.
High Temperature
Resistance
Appearance: No physical damage
Capacitance: Within tolerance
Dielectric Loss: Within tolerance
Insulation Resistance: Within tolerance
Temp: 70°C 2°C
Bias: 150% of rated voltage
Test Time: 1000+48/-0 hour
Humidity Resistance
(unload)
Appearance: No physical damage
Capacitance: Within tolerance
Dielectric Loss: Within tolerance
Insulation Resistance: Within tolerance
Temp: 85°C 2°C
Humidity: 85% 5%
Test Time: 500+24/-0 hour
Vending Substrate
Appearance: No physical damage
Capacitance: Within tolerance
After soldering a chip to a test substrate,
bend the substrate by 1 mm and then measure.
The substrate is GE4
20
or based on GE4.
Substrate
Weight
Displacement
45
2
45
2
PAGE 5 OF 8
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P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA [ KOA SPEER ELECTRONICS, INC. ]
