KOA SPEER ELECTRONICS, INC.
SS-227 R2
7. Pattern design
The land pattern is recommended as follows.
0603 Chip
Mounting Side
0805 Chip
Mounting Side
1206 Chip
Mounting Side
Through
Hole
ø 0.5
0.6
Resist
0.6
Resist
0.4
0.4
1.2
2.4
ø 0.3
Through Hole
0.8
1.4
2.8
ø 0.3
Through Hole
Resist
1.0
2.4
5.0
1812 Chip
Mounting Side
0603, 0805, 1206,
1812 Back Side
Connect to
ground pattern
of mounting side
ø 0.5
Through Hole
Ground
Pattern
0.8
3.5
6.5
(unit: mm)
8. Characteristics
Item
Requirement
Conditions
Insulation Resistance
Capacitance
Min 1000M ohms
Within the tolerance
Applied rated voltage for 60 seconds.
Frequency: 1kHz
Voltage: 1Vrms
DC Resistance
Max 60m ohms
No break down
DC: 0.3V Max.
Dielectric Withstanding
Strength
Applied 250% of the rated voltage for 1 to 5
seconds. Limit surge current 50mA max.
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Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA [ KOA SPEER ELECTRONICS, INC. ]
