3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.2
1.1
1.0
0.9
0.8
ꢀ
Notes:
1. VGS = 0 V
ꢀ
Notes :
ꢁ
A
2. ID= 250
1. V = 10 V
2. IDG=S 2.2 A
-100
-50
0
50
100
150
200
-100
-50
0
50
100
150
200
T, Junction Temperature [oC]
T, Junction Temperature [oC]
J
J
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Operation in This Area
is Limited by R DS(on)
101
100 µs
1 ms
10 ms
100 ms
100
DC
-1
10
ꢀ
Notes :
1. TC = 25 o
C
2. TJ = 150 o
C
3. Single Pulse
-2
10
100
101
102
103
25
50
75
100
125
150
ꢀ
TC, Case Temperature [
]
VDS, Drain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
D = 0 .5
1 0 0
0 .2
ꢀ
N o te s
1 . J C(t)
2 . D u ty F a c to r, D = t1 /t2
:
ꢂ
/W M a x .
Z
=
3 .4 7
0 .1
ꢀ
3 . T J M
-
T C
=
P D
*
Z
J C(t)
ꢀ
M
0 .0 5
1 0-1
0 .0 2
PDM
0 .0 1
t1
t2
s in g le p u ls e
1 0-2
1 0 -5
1 0-4
1 0 -3
1 0 -2
1 0 -1
1 0 0
1 0 1
t1 , S q u a re W a v e P u ls e D u ra tio n [s e c ]
Figure 11. Transient Thermal Response Curve
KERSEMI [ Kersemi Electronic Co., Ltd. ]
