MECHANICAL DIMENSIONS
PC Board Pattern
(Top View)
8 Pin Surface Mount (“S” Suffix)
Tape and Reel Packaging for 8 Pin Surface Mount Package
330.2 DIA.
(13.00)
Top Cover
Tape Thickness
0.102 MAX.
(0.004)
W = 16.30 max
(0.642 max)
BO = 10.30
(0.406)
Top Cover
Tape
P = 12.00
(0.472)
AO = 10.30
(0.406)
Embossed Carrier
K1 = 4.20
(0.165)
K0 = 4.90
(0.193)
User Direction of Feed
Embossment
NOTE: Tape dimensions not shown, comply with JEDEC Standard EIA-481-2
Dimensions:
mm
(inches)
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product
descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no
liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement
of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended
to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to
discontinue or make changes to its products at any time without notice.
Specification: DS-LIA120-R02.0
©Copyright 2005, Clare, Inc.
All rights reserved. Printed in USA.
2/17/05
IXYS [ IXYS CORPORATION ]
