®
PACKAGINGINFORMATION
ISSI
Plastic TSOP - 32 pins
Package Code: T (Type I)
1
E
H
N
D
SEATING PLANE
A
S
L
α
e
B
C
A1
Plastic TSOP (T—Type I)
Millimeters
Min Max
Inches
Symbol
Min
Max
Ref. Std.
No. Leads
32
A
A1
B
C
D
E
H
e
—
1.20
0.25
0.23
—
0.047
0.010
0.009
0.014
0.316
0.722
0.788
Notes:
1. Controlling dimension: millimeters, unless otherwise
specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash
protrusions and should be measured from the bottom of
0.05
0.17
0.12
7.90
18.30
19.80
0.002
0.007
0.006
0.308
0.714
0.772
0.17
8.10
18.50
20.20
the package
.
4. Formed leads shall be planar with respect to one
another within 0.004 inches at the seating plane.
0.50 BSC
0.020 BSC
L
0.40
0.60
0.016
0.024
α
0°
8°
0°
8°
Integrated Silicon Solution, Inc.
1
PK13197T32 Rev. B 01/31/97
ISSI [ INTEGRATED SILICON SOLUTION, INC ]
