®
PACKAGING INFORMATION
ISSI
Plastic STSOP - 32 pins
Package Code: H (Type I)
A2
A
A1
1
N
E
b
e
D1
D
S
SEATING PLANE
L
α
C
Plastic STSOP (H - Type I)
Millimeters
Inches
Notes:
Symbol Min Max
Min
Max
1. Controlling dimension: millimeters, unless otherwise
specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protru-
sions and should be measured from the bottom of the package
Ref. Std.
N
32
A
A1
A2
b
C
D
D1
E
e
—
0.05
1.25
—
—
0.049
—
0.041
0.009
.
4. Formed leads shall be planar with respect to one another
within 0.004 inches at the seating plane.
0.002
0.037
0.007
0.95 1.05
0.17 0.23
0.14 0.16
13.20 13.60
11.70 11.90
7.90 8.10
0.50 BSC
0.0055 0.0063
0.520
0.461
0.311
0.535
0.469
0.319
0.020 BSC
L
S
0.30 0.70
0.28 Typ.
0.012
0.011 Typ.
0.028
α
0°
5°
0°
5°
Integrated Silicon Solution, Inc.
PK13197H32 Rev.B 04/21/03
ISSI [ INTEGRATED SILICON SOLUTION, INC ]
