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ISL83088EIBZ-T 参数 Datasheet PDF下载

ISL83088EIBZ-T图片预览
型号: ISL83088EIBZ-T
PDF下载: 下载PDF文件 查看货源
内容描述: + -15kV的ESD保护, 5V,全故障保护,分数( 1/8 )机组负荷, RS - 485 / RS -422收发器 [+-15kV ESD Protected, 5V, Full Fail-Safe, Fractional (1/8) Unit Load, RS-485/RS-422 Transceivers]
分类和应用:
文件页数/大小: 18 页 / 828 K
品牌: INTERSIL [ Intersil ]
 浏览型号ISL83088EIBZ-T的Datasheet PDF文件第10页浏览型号ISL83088EIBZ-T的Datasheet PDF文件第11页浏览型号ISL83088EIBZ-T的Datasheet PDF文件第12页浏览型号ISL83088EIBZ-T的Datasheet PDF文件第13页浏览型号ISL83088EIBZ-T的Datasheet PDF文件第14页浏览型号ISL83088EIBZ-T的Datasheet PDF文件第15页浏览型号ISL83088EIBZ-T的Datasheet PDF文件第17页浏览型号ISL83088EIBZ-T的Datasheet PDF文件第18页  
ISL83080E, ISL83082E, ISL83083E, ISL83085E, ISL83086E, ISL83088E  
Mini Small Outline Plastic Packages (MSOP)  
N
M8.118 (JEDEC MO-187AA)  
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE  
INCHES  
MILLIMETERS  
E1  
E
SYMBOL  
MIN  
MAX  
MIN  
0.94  
0.05  
0.75  
0.25  
0.09  
2.95  
2.95  
MAX  
1.10  
0.15  
0.95  
0.36  
0.20  
3.05  
3.05  
NOTES  
A
A1  
A2  
b
0.037  
0.002  
0.030  
0.010  
0.004  
0.116  
0.116  
0.043  
0.006  
0.037  
0.014  
0.008  
0.120  
0.120  
-
-B-  
0.20 (0.008)  
INDEX  
AREA  
1 2  
A
B
C
-
-
TOP VIEW  
4X θ  
9
0.25  
(0.010)  
R1  
c
-
R
GAUGE  
PLANE  
D
3
E1  
e
4
SEATING  
PLANE  
L
0.026 BSC  
0.65 BSC  
-
-C-  
4X θ  
L1  
A
A2  
E
0.187  
0.016  
0.199  
0.028  
4.75  
0.40  
5.05  
0.70  
-
L
6
SEATING  
PLANE  
L1  
N
0.037 REF  
0.95 REF  
-
0.10 (0.004)  
-A-  
C
C
b
8
8
7
-H-  
A1  
e
R
0.003  
0.003  
-
-
0.07  
0.07  
-
-
-
D
0.20 (0.008)  
C
R1  
0
-
o
o
o
o
5
15  
5
15  
-
a
SIDE VIEW  
C
L
o
o
o
o
0
6
0
6
-
α
E
1
-B-  
Rev. 2 01/03  
0.20 (0.008)  
C
D
END VIEW  
NOTES:  
1. These package dimensions are within allowable dimensions of  
JEDEC MO-187BA.  
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.  
3. Dimension “D” does not include mold flash, protrusions or gate  
burrs and are measured at Datum Plane. Mold flash, protrusion  
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.  
4. Dimension “E1” does not include interlead flash or protrusions  
- H -  
and are measured at Datum Plane.  
Interlead flash and  
protrusions shall not exceed 0.15mm (0.006 inch) per side.  
5. Formed leads shall be planar with respect to one another within  
0.10mm (0.004) at seating Plane.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “b” does not include dambar protrusion. Allowable  
dambar protrusion shall be 0.08mm (0.003 inch) total in excess  
of “b” dimension at maximum material condition. Minimum space  
between protrusion and adjacent lead is 0.07mm (0.0027 inch).  
- B -  
to be determined at Datum plane  
-A -  
10. Datums  
and  
.
- H -  
11. Controlling dimension: MILLIMETER. Converted inch dimen-  
sions are for reference only.  
FN6085.6  
16  
September 12, 2005  
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