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IRFP460 参数 Datasheet PDF下载

IRFP460图片预览
型号: IRFP460
PDF下载: 下载PDF文件 查看货源
内容描述: 20A , 500V , 0.270 Ohm的N通道功率MOSFET [20A, 500V, 0.270 Ohm, N-Channel Power MOSFET]
分类和应用: 晶体晶体管开关脉冲局域网
文件页数/大小: 7 页 / 59 K
品牌: INTERSIL [ Intersil ]
 浏览型号IRFP460的Datasheet PDF文件第1页浏览型号IRFP460的Datasheet PDF文件第3页浏览型号IRFP460的Datasheet PDF文件第4页浏览型号IRFP460的Datasheet PDF文件第5页浏览型号IRFP460的Datasheet PDF文件第6页浏览型号IRFP460的Datasheet PDF文件第7页  
IRFP460  
o
Absolute Maximum Ratings  
T = 25 C, Unless Otherwise Specified  
C
IRFP460  
500  
UNITS  
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
V
V
A
A
A
V
W
DS  
Drain to Gate Voltage (R  
GS  
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V  
500  
DGR  
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I  
20  
12  
D
D
o
T
= 100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I  
C
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
80  
DM  
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
±20  
GS  
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
250  
D
o
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
2.0  
W/ C  
Single Pulse Avalanche Energy Rating (Note 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E  
960  
mJ  
AS  
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T  
J
-55 to 150  
C
STG  
Maximum Temperature for Soldering  
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T  
o
300  
260  
C
C
L
o
pkg  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
o
o
1. T = 25 C to T = 125 C.  
J
J
o
Electrical Specifications  
T = 25 C, Unless Otherwise Specified  
C
PARAMETER  
SYMBOL  
BV  
TEST CONDITIONS  
= 0V (Figure 10)  
MIN  
TYP  
-
MAX UNITS  
Drain to Source Breakdown Voltage  
Gate Threshold Voltage  
I
= 250µA, V  
D GS  
500  
-
4
V
V
DSS  
V
V
V
V
V
V
= V , I = 250µA  
DS  
2
-
-
GS(TH)  
GS  
DS  
DS  
DS  
GS  
D
Zero Gate Voltage Drain Current  
I
= Rated BV  
, V  
DSS GS  
= 0V  
-
25  
µA  
µA  
A
DSS  
o
= 0.8 x Rated BV  
, V  
= 0V, T = 125 C  
-
-
250  
-
DSS GS  
J
On-State Drain Current (Note 2)  
Gate to Source Leakage Current  
I
> I  
D(ON)  
x r  
DS(ON)MAX GS  
, V  
= 10V  
20  
-
-
D(ON)  
I
= ±20V  
-
±100  
0.27  
-
nA  
GSS  
Drain to Source On Resistance (Note 2)  
Forward Transconductance (Note 2)  
Turn-On Delay Time  
r
I
= 11A, V  
D GS  
= 10V (Figures 8, 9)  
> 11A (Figure 12)  
= 4.3, R = 12,  
-
0.24  
19  
23  
81  
85  
65  
120  
DS(ON)  
g
V
50V, I  
DS  
13  
-
S
DS  
fs  
t
V
V
= 250V, I = 21A, R  
GS  
35  
ns  
ns  
ns  
ns  
nC  
d(ON)  
DD  
GS  
D
D
= 10V MOSFET Switching Times are Essentially  
Rise Time  
t
-
120  
130  
98  
r
Independent of Operating Temperature  
Turn-Off Delay Time  
t
-
d(OFF)  
Fall Time  
t
-
f
Total Gate Charge  
Q
V
= 10V, I = 21A, V  
= 0.8 x Rated BV  
DSS,  
-
190  
g(TOT)  
GS  
D
DS  
(Gate to Source + Gate-Drain)  
I
= 1.5mA (Figure 14). Gate Charge is  
G(REF)  
Essentially Independent of OperatingTemperature  
Gate to Source Charge  
Gate to Drain “Miller” Charge  
Input Capacitance  
Q
Q
-
-
-
-
-
-
18  
62  
-
-
-
-
-
-
nC  
nC  
pF  
pF  
pF  
nH  
gs  
gd  
C
V
= 25V, V  
DS GS  
= 0V, f = 1MHz (Figure 10)  
4100  
480  
84  
ISS  
Output Capacitance  
C
OSS  
RSS  
Reverse Transfer Capacitance  
Internal Drain Inductance  
C
L
Measured from the Drain  
Lead, 6mm (0.25in) from  
Package to Center of Die  
Modified MOSFET  
Symbol Showing the  
Internal Device  
5.0  
D
Inductances  
Internal Source Inductance  
L
Measured from the Source  
Lead, 6mm (0.25in) from  
Header to Source Bonding  
Pad  
-
13  
-
nH  
S
D
L
D
G
L
S
S
o
o
Thermal Resistance Junction to Case  
Thermal Resistance Junction to Ambient  
R
R
-
-
-
-
0.50  
30  
C/W  
C/W  
θJC  
Free Air Operation  
θJA  
4-360