HIP6601A, HIP6603A, HIP6604
Small Outline Expos ed Pad Plas tic Packages (EPSOIC)
M8.15B
N
8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD
PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
E
INCHES
MILLIMETERS
-B-
SYMBOL
MIN
MAX
MIN
1.43
0.03
0.35
0.19
4.80
3.31
MAX
1.68
0.13
0.49
0.25
4.98
3.39
NOTES
A
A1
B
C
D
E
e
0.056
0.001
0.0138
0.0075
0.189
0.150
0.066
0.005
0.0192
0.0098
0.196
0.157
-
1
2
3
-
TOP VIEW
9
-
L
3
SEATING PLANE
A
4
-A-
D
0.050 BSC
1.27 BSC
-
o
h x 45
H
h
0.230
0.010
0.016
0.244
0.016
0.035
5.84
0.25
0.41
6.20
0.41
0.64
-
-C-
5
α
µ
L
6
e
B
A1
C
N
8
8
7
0.10(0.004)
o
o
o
o
0
8
0
8
-
11
α
P
0.25(0.010) M
SIDE VIEW
C A M B S
-
-
0.090
0.090
-
-
2.286
2.286
P1
11
Rev. 0 6/00
NOTES:
1
2
3
1. Symbols are defined in the “MO Series Symbol List” in
Section 2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
P1
3. Dimension “D” does not include mold flash, protrusions or
gate burrs. Mold flash, protrusion and gate burrs shall not
exceed 0.15mm (0.006 inch) per side.
N
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm
(0.010 inch) per side.
P
BOTTOM VIEW
5. The chamfer on the body is optional. If it is not present, a
visual index feature must be located within the crosshatched
area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or
greater above the seating plane, shall not exceed a
maximum value of 0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
11. Dimensions “P” and “P1” are thermal and/or electrical
enhanced variations. Values shown are maximum size of
exposed pad within lead count and body size.
9
INTERSIL [ Intersil ]
