CD4514BMS, CD4515BMS
Chip Dimensions and Pad Layouts
112
0
10
20 30 40
50 60 70 80 90 100 110
74
70
60
50
40
30
71-79
(1.804-2.006)
20
10
0
4-10
(0.102-0.254)
109-117
(2.769-2.971)
Dimensions in parentheses are in milimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch.)
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
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notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
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