CD4070BMS, CD4077BMS
Typical Performance Characteristics (Continued)
105
AMBIENT TEMPERATURE (TA) = +25oC
6
4
2
AMBIENT TEMPERATURE (TA) = +25oC
LOAD CAPACITANCE (CL) = 50pF
104
103
6
4
2
SUPPLY VOLTAGE
(VDD) = 15V
300
6
4
2
102
10
200
100
6
4
2
10V
10V
5V
6
4
2
LOAD CAPACITANCE
CL = 50pF
1
6
4
2
CL = 15pF
10-1
2
4
6 8
103
2
4
6 8
104
2
4
6 8
2
4
6 8
10
2
4
6 8
102
0
5
10
15
20
10-1
1
SUPPLY VOLTAGE (VDD) (V)
INPUT FREQUENCY (fI) (kHz)
FIGURE 9. TYPICAL PROPAGATION DELAY TIME AS A
FUNCTION OF SUPPLY VOLTAGE
FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A
FUNCTION OF INPUT FREQUENCY
Chip Dimensions and Pad Layout
CD4077BMSH
Dimensions and pad layout for CD4070BMSH are
identical
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
7-462
INTERSIL [ Intersil ]
