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5962R9582401QXC 参数 Datasheet PDF下载

5962R9582401QXC图片预览
型号: 5962R9582401QXC
PDF下载: 下载PDF文件 查看货源
内容描述: 抗辐射的8位CMOS微处理器 [Radiation Hardened 8-Bit CMOS Microprocessor]
分类和应用: 外围集成电路微处理器时钟
文件页数/大小: 19 页 / 162 K
品牌: INTERSIL [ Intersil ]
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HS-80C85RH  
Packaging  
K42.A TOP BRAZED  
E
N
42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE  
INCHES MILLIMETERS  
MIN  
1
A
A
e
SYMBOL  
MAX  
0.100  
0.025  
0.023  
0.013  
0.010  
1.075  
0.650  
0.680  
0.550  
MIN  
-
MAX  
2.54  
NOTES  
D
A
b
-
-
-
b
0.017  
0.017  
0.007  
0.007  
1.045  
0.630  
-
0.43  
0.43  
0.18  
0.18  
26.54  
16.00  
-
0.64  
E1  
b1  
c
0.58  
-
S1  
C
0.33  
-
L
c1  
D
0.25  
-
A
Q
27.31  
16.51  
17.27  
13.97  
3
-
E2  
E
E1  
E2  
e
3
-
c1  
LEAD FINISH  
0.530  
13.46  
0.050 BSC  
1.27 BSC  
11  
-
BASE  
METAL  
(c)  
k
-
-
-
8.13  
1.14  
0.00  
-
-
8.89  
1.65  
-
b1  
M
L
0.320  
0.045  
0.000  
-
0.350  
0.065  
-
-
M
Q
S1  
M
N
8
6
-
(b)  
SECTION A-A  
NOTES:  
0.0015  
0.04  
1. Index area: A notch or a pin one identification mark shall be locat-  
ed adjacent to pin one and shall be located within the shaded  
area shown. The manufacturer’s identification shall not be used  
as a pin one identification mark. Alternately, a tab (dimension k)  
may be used to identify pin one.  
42  
42  
-
Rev. 0 6/17/94  
2. If a pin one identification mark is used in addition to a tab, the lim-  
its of dimension k do not apply.  
3. This dimension allows for off-center lid, meniscus, and glass  
overrun.  
4. Dimensions b1 and c1 apply to lead base metal only. Dimension  
M applies to lead plating and finish thickness. The maximum lim-  
its of lead dimensions b and c or M shall be measured at the cen-  
troid of the finished lead surfaces, when solder dip or tin plate  
lead finish is applied.  
5. N is the maximum number of terminal positions.  
6. Measure dimension S1 at all four corners.  
7. For bottom-brazed lead packages, no organic or polymeric mate-  
rials shall be molded to the bottom of the package to cover the  
leads.  
8. Dimension Q shall be measured at the point of exit (beyond the  
meniscus) of the lead from the body. Dimension Q minimum  
shall be reduced by 0.0015 inch (0.038mm) maximum when sol-  
der dip lead finish is applied.  
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.  
10. Controlling dimension: INCH.  
11. The basic lead spacing is 0.050 inch (1.27mm) between center  
lines. Each lead centerline shall be located within ±0.005 inch  
(0.13mm) of its exact longitudinal position relative to lead 1 and  
the highest numbered (N) lead.  
Spec Number 518054  
18  
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