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5962D0823001V9A 参数 Datasheet PDF下载

5962D0823001V9A图片预览
型号: 5962D0823001V9A
PDF下载: 下载PDF文件 查看货源
内容描述: 抗辐射,请参阅硬化,非反相,四路CMOS驱动器 [Radiation Hardened, SEE Hardened, Non-Inverting, Quad CMOS Driver]
分类和应用: 驱动器接口集成电路
文件页数/大小: 12 页 / 383 K
品牌: INTERSIL [ Intersil ]
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ISL7457SRH  
Ceramic Metal Seal Flatpack Packages (Flatpack)  
K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B)  
16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE  
A
A
e
INCHES MILLIMETERS  
MIN  
PIN NO. 1  
ID AREA  
SYMBOL  
MAX  
0.115  
0.022  
0.019  
0.009  
0.006  
0.440  
0.285  
0.315  
-
MIN  
1.14  
0.38  
0.38  
0.10  
0.10  
-
MAX  
2.92  
0.56  
0.48  
0.23  
0.15  
11.18  
7.24  
8.00  
-
NOTES  
D
A
b
0.045  
0.015  
0.015  
0.004  
0.004  
-
-
-
-A-  
-B-  
S1  
b1  
c
-
-
b
c1  
D
-
E1  
3
-
0.004  
Q
H
A - B  
D
0.036  
H
A - B  
D
S
M
S
S
M
S
C
E
0.245  
-
6.22  
-
E
E1  
E2  
E3  
e
3
-
-D-  
A
0.130  
0.030  
3.30  
0.76  
-H-  
-C-  
-
-
7
-
L
E2  
L
E3  
E3  
0.050 BSC  
1.27 BSC  
SEATING AND  
BASE PLANE  
c1  
LEAD FINISH  
k
0.008  
0.250  
0.026  
0.005  
-
0.015  
0.370  
0.045  
-
0.20  
6.35  
0.66  
0.13  
-
0.38  
9.40  
1.14  
-
2
-
L
BASE  
METAL  
Q
S1  
M
N
8
6
-
(c)  
b1  
0.0015  
0.04  
M
M
(b)  
16  
16  
-
SECTION A-A  
Rev. 1 2-20-95  
NOTES:  
1. Index area: A notch or a pin one identification mark shall be locat-  
ed adjacent to pin one and shall be located within the shaded  
area shown. The manufacturer’s identification shall not be used  
as a pin one identification mark. Alternately, a tab (dimension k)  
may be used to identify pin one.  
2. If a pin one identification mark is used in addition to a tab, the lim-  
its of dimension k do not apply.  
3. This dimension allows for off-center lid, meniscus, and glass  
overrun.  
4. Dimensions b1 and c1 apply to lead base metal only. Dimension  
M applies to lead plating and finish thickness. The maximum lim-  
its of lead dimensions b and c or M shall be measured at the cen-  
troid of the finished lead surfaces, when solder dip or tin plate  
lead finish is applied.  
5. N is the maximum number of terminal positions.  
6. Measure dimension S1 at all four corners.  
7. For bottom-brazed lead packages, no organic or polymeric mate-  
rials shall be molded to the bottom of the package to cover the  
leads.  
8. Dimension Q shall be measured at the point of exit (beyond the  
meniscus) of the lead from the body. Dimension Q minimum  
shall be reduced by 0.0015 inch (0.038mm) maximum when sol-  
der dip lead finish is applied.  
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.  
10. Controlling dimension: INCH  
FN6874.0  
March 16, 2009  
12