ISL7457SRH
Layout Characteristics
Step and Repeat: 2390 µm x 2445 µm
The DELAY pad is not bonded.
TABLE 1. LAYOUT X-Y COORDINATES
X
Y
DX
DY
PROBES
PAD NAME
IND
(µm)
(µm)
(µm)
(µm) PER PAD
675
995
190
190
140
140
122
122
122
140
140
133
133
345
1
1
1
1
2
V -
S
OUTD
OUTC
2118
2118
2118
2118
2118
2118
1015
608
490
795
V
1039
1211
1554
1861
2140
2140
1993
1673
1331
1159
864
H
OUTB
OUTA
122
122
140
140
140
140
140
133
133
140
140
140
140
345
1
1
1
1
1
1
2
V +
S
INA
OE
213
INB
213
V
213
L
213
GND
DELAY
INC
213
140
140
140
140
140
140
1
0
1
213
585
213
213
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6874.0
March 16, 2009
11
INTERSIL [ Intersil ]
