HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Ordering Information (Continued)
Ordering Information (Continued)
TEMP.
RANGE
(°C)
TEMP.
RANGE
(°C)
PART
MARKING
PKG.
DWG. #
PART
MARKING
PKG.
DWG. #
PART NO.
PACKAGE
PART NO.
HIN232ECA
PACKAGE
HIN208EIAZ
(Note)
HIN208EIAZ -40 to 85 24 Ld SSOP
(Pb-free)
M24.209
HIN232ECA
0 to 70 16 Ld SSOP
M16.209
M16.209
HIN232ECA-T
HIN232ECA 16 Ld SSOP Tape and
Reel
HIN208EIAZ-T
(Note)
HIN208EIAZ 24 Ld SSOP Tape and
Reel (Pb-free)
M24.209
HIN232ECAZ-T HIN232ECAZ 16 Ld SSOP Tape and
M16.209
HIN208EIB
HIN208EIB
-40 to 85 24 Ld SOIC
M24.3
M24.3
(Note)
Reel (Pb-free)
HIN208EIBZ
(Note)
HIN208EIBZ -40 to 85 24 Ld SOIC
(Pb-free)
HIN232ECB
HIN232ECB-T
HIN232ECB
0 to 70 16 Ld SOIC (W) M16.3
HIN232ECB 16 Ld SOIC (W) Tape and M16.3
Reel
HIN211ECA
HIN211ECA
0 to 70 28 Ld SSOP
M28.209
M28.209
HIN211ECA-T
HIN211ECA 28 Ld SSOP Tape and
Reel
HIN232ECBN
HIN232ECBN 0 to 70 16 Ld SOIC (N) M16.15
HIN232ECBN-T HIN232ECBN 16 Ld SOIC (N) Tape and M16.15
Reel
HIN211ECAZ
(Note)
HIN211ECAZ 0 to 70 28 Ld SSOP
(Pb-free)
M28.209
M28.209
HIN232ECBNZ 232ECBNZ
(Note)
0 to 70 16 Ld SOIC (N) M16.15
(Pb-free)
HIN211ECAZ-T HIN211ECAZ 28 Ld SSOP Tape and
(Note)
Reel (Pb-free)
HIN232ECBNZ-T 232ECBNZ
(Note)
16 Ld SOIC (N) Tape and M16.15
Reel (Pb-free)
HIN211ECB
HIN211ECB
0 to 70 28 Ld SOIC
M28.3
M28.3
HIN211ECBZ
(Note)
HIN211ECBZ 0 to 70 28 Ld SOIC
(Pb-free)
HIN232ECBZ
(Note)
232ECBZ
0 to 70 16 Ld SOIC (W) M16.3
(Pb-free)
HIN211ECBZ-T HIN211ECBZ 28 Ld SOIC Tape and
M28.3
HIN232ECBZ-T 232ECBZ
(Note)
16 Ld SOIC (W) Tape and M16.3
Reel (Pb-free)
(Note)
Reel (Pb-free)
HIN211EIA
HIN211EIA-T
HIN211EIA
HIN211EIA
-40 to 85 28 Ld SSOP
M28.209
M28.209
HIN232ECP
HIN232ECP
0 to 70 16 Ld PDIP
E16.3
E16.3
28 Ld SSOP Tape and
Reel
HIN232ECPZ
(Note)
HIN232ECPZ 0 to 70 16 Ld PDIP*
(Pb-free)
HIN211EIAZ
(Note)
HIN211EIAZ -40 to 85 28 Ld SSOP
(Pb-free)
M28.209
M28.209
HIN232EIBN
HIN232EIBN -40 to 85 16 Ld SOIC (N) M16.15
HIN232EIBN-T HIN232EIBN 16 Ld SOIC (N) Tape and M16.15
Reel
HIN211EIAZ-T
(Note)
HIN211EIAZ 28 Ld SSOP Tape and
Reel (Pb-free)
HIN232EIBNZ
(Note)
232EIBNZ
-40 to 85 16 Ld SOIC (N) M16.15
(Pb-free)
HIN211EIB
HIN211EIB
-40 to 85 28 Ld SOIC
M28.3
M28.3
HIN211EIBZ
(Note)
HIN211EIBZ -40 to 85 28 Ld SOIC
(Pb-free)
HIN232EIBNZ-T 232EIBNZ
(Note)
16 Ld SOIC (N) Tape and M16.15
Reel (Pb-free)
HIN213ECA
HIN213ECA
0 to 70 28 Ld SSOP
M28.209
M28.209
HIN232EIV
HIN232EIV
HIN232EIV
-40 to 85 16 Ld TSSOP M16.173
HIN213ECA-T
HIN213ECA 28 Ld SSOP Tape and
Reel
HIN232EIV-T
16 Ld TSSOP Tape and M16.173
Reel
HIN213ECAZ
(Note)
HIN213ECAZ 0 to 70 28 Ld SSOP
(Pb-free)
M28.209
M28.209
HIN232EIVZ
(Note)
232EIVZ
232EIVZ
-40 to 85 16 Ld TSSOP M16.173
(Pb-free)
HIN213ECAZ-T HIN213ECAZ 28 Ld SSOP Tape and
(Note)
HIN232EIVZ-T
(Note)
16 Ld TSSOP Tape and M16.173
Reel (Pb-free)
Reel (Pb-free)
HIN213EIA
HIN213EIA-T
HIN213EIA
HIN213EIA
-40 to 85 28 Ld SSOP
M28.209
M28.209
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
28 Ld SSOP Tape and
Reel
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
HIN213EIAZ
(Note)
HIN213EIAZ -40 to 85 28 Ld SSOP
(Pb-free)
M28.209
M28.209
HIN213EIAZ-T
(Note)
HIN213EIAZ 28 Ld SSOP Tape and
Reel (Pb-free)
HIN213EIB
HIN213EIB
-40 to 85 28 Ld SOIC
M28.3
M28.3
HIN213EIBZ
(Note)
HIN213EIBZ -40 to 85 28 Ld SOIC
(Pb-free)
FN4315.16
3
November 4, 2005