ISL8225M
Reflow Parameters
300
250
200
150
100
50
PEAK TEMPERATURE +230°C~+245°C;
TYPICALLY 60s-70s ABOVE +220°C
KEEP LESS THAN 30s WITHIN 5°C OF PEAK TEMP.
Due to the low mount height of the QFN, "No Clean" Type 3 solder
paste, per ANSI/J-STD-005, is recommended. Nitrogen purge is
also recommended during reflow. A system board reflow profile
depends on the thermal mass of the entire populated board, so it
is not practical to define a specific soldering profile just for the
QFN. The profile given in Figure 41 is provided as a guideline to
customize for varying manufacturing practices and applications.
SLOW RAMP (3°C/s MAX)
AND SOAK FROM +100°C
TO +180°C FOR 90s~120s
RAMP RATE ≤1.5°C FROM +70°C TO +90°C
0
0
100
150
200
250
300
350
DURATION (s)
FIGURE 41. TYPICAL REFLOW PROFILE
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest revision.
DATE
REVISION
FN7822.1
CHANGE
January 4, 2013
“Thermal Information” on page 6:
Changed “Maximum Storage Temperature Range” from "-40°C to +150°C" to "-55°C to +150°C"
“Selection of Input Capacitor” on page 19:
Added "f " to Equation 2. Added "f
SW
is the switching frequency (Hz)"
SW
December 3, 2012
FN7822.0
Initial Release
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FN7822.1
January 31, 2013
26