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313955 参数 Datasheet PDF下载

313955图片预览
型号: 313955
PDF下载: 下载PDF文件 查看货源
内容描述: 英特尔® 3000和3010芯片组内存控制器中枢( MCH ) [Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH)]
分类和应用: 内存控制器
文件页数/大小: 38 页 / 1845 K
品牌: INTEL [ INTEL CORPORATION ]
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目录
1
介绍
.............................................................................................................. 7
1.1
术语定义............................................... ............................................... 7
1.2
参考文献................................................ .......................................... 8
包装技术
............................................................................................... 9
2.1
包装机械需求............................................... ........................ 11
热规格
............................................................................................ 13
3.1
热设计功耗( TDP ) ............................................ .................................. 13
3.2
模具外壳温度............................................... ........................................ 13
热模拟
................................................................................................. 15
热计量
.................................................................................................. 17
5.1
模具温度测量............................................... ........................... 17
5.1.1零度角安装方法.......................................... ........... 17
5.2
电力仿真软件............................................... .................................. 19
引用散热解决方案............................................... ......................................
21
6.1
操作环境................................................ ...................................... 21
6.2
散热器性能................................................ ........................................ 21
6.3
机械设计信封............................................... ................................ 22
6.4
板级元件布线框尺寸............................................ .......... 23
6.5
塑料波峰焊散热器散热解决方案大会................................... 23
6.5.1散热器定位............................................. .................................. 24
6.5.2挤压散热器型材............................................ ........................... 25
6.5.3机械接口材料............................................ ....................... 25
6.5.4热介面材料............................................ ........................... 25
6.5.5散热片剪辑............................................. ........................................... 26
6.5.6剪辑保留锚............................................ ................................ 26
6.6
可靠性准则................................................ .......................................... 27
散热解决方案组件供应商
................................................................... 29
A.1
塑料波峰焊散热器散热解决方案............................................ ..... 29
机械制图
............................................................................................... 31
2
3
4
5
6
A
B
英特尔3000和3010芯片组内存控制器中枢( MCH )热/机械指南
3