28F640L30, 28F128L30, 28F256L30
Figure 42. Mechanical Specification for the 256-Mbit device in an 88-ball (80-active ball) Intel®
Ultra-Thin Stacked Chip Scale Package Drawing and Dimensions
UT 8x11x1.0Q
A1 Index
Mark
S1
8
7
6
5
4
3
2
1
2
3
4
5
6
7
8
1
S2
A
A
B
C
B
C
D
D
E
F
E
F
D
e
G
H
G
H
J
J
K
K
L
L
M
M
b
E
Top View - Ball Down
Bottom View - Ball Up
A
A2
A1
Y
Drawing not to scale.
Note: Dimensions A1, A2, and b are preliminary
Millimeters
Nom
Inches
Nom
Dimensions
Package Height
Symbol
A
Min
Max Notes
1.00
Min
Max
0.0394
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Length
Package Body Width
Pitch
A1
A2
b
D
E
0.117
0.0046
0.740
0.350
11.00
8.00
0.80
88
0.0291
0.0138
0.4331
0.3150
0.0315
88
0.300
10.900
7.900
0.400
11.100
8.100
0.0118
0.4291
0.3110
0.0157
0.4370
0.3189
e
N
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1Distance Along E
Corner to Ball A1Distance Along D
Y
S1
S2
0.100
1.300
1.200
0.0039
0.0512
0.0472
1.100
1.000
1.200
1.100
0.0433
0.0394
0.0472
0.0433
96
Datasheet
INTEL [ INTEL ]
