28F640L30, 28F128L30, 28F256L30
Figure 41. Mechanical Specification for the 128-Mbit device in an 88-ball (80-active ball) Intel®
Stacked Chip Scale Package Drawing and Dimensions
8x10x1.2Q
A1 Index
Mark
S1
8
7
6
5
4
3
2
1
1
2
3
4
5
6
7
8
S2
A
A
B
C
D
B
C
D
E
F
E
F
D
e
G
G
H
H
J
J
K
K
L
L
M
M
b
E
Bottom View - Ball
Up
Top View - Ball Down
A2
A1
A
Y
Draw ing not to scale.
Millimeters
N om
Inches
N om
Di me ns i ons
Package Height
Ball Height
Package Body Thickne ss
Ball (Lead) Width
Package Body Length
Package Body Width
Pitch
S ymbol
A
Mi n
Max Not e s
1.200
Mi n
Max
0.0472
A1
A2
b
D
E
0.200
0.0079
0.860
0.375
10.000
8.000
0.800
88
0.0339
0.0148
0.3937
0.3150
0.0315
88
0.325
9.900
7.900
0.425
10.100
8.100
0.0128
0.3898
0.3110
0.0167
0.3976
0.3189
e
N
Ball (Lead) Count
Se ating Plane Coplanarity
Cor ne r to Ball A1 Distance Along E
Cor ne r to Ball A1 Distance Along D
Y
S1
S2
0.100
1.300
0.700
0.0039
0.0512
0.0276
1.100
0.500
1.200
0.600
0.0433
0.0197
0.0472
0.0236
Datasheet
95
INTEL [ INTEL ]
