Intel® IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
5.4.6
MDIO DC Parameters
Table 30.
MDIO DC Parameters
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
Notes
VIH
VIL
Input-high voltage
Input-low voltage
Output-high voltage
Output-low voltage
2.0
V
V
0.8
VOH
IOUT = -4 mA
IOUT = 4 mA
2.4
-10
V
VOL
0.4
10
V
IIL
Input-leakage current 0 < VIN < VCCP
Input-pin capacitance
µA
pF
pF
CIN
5
5
1
1
CINMDIO
Input-pin capacitance
Note:
1.
These values are typical values seen by the manufacturing process and are not tested.
5.4.7
SDRAM Bus DC Parameters
Table 31.
SDRAM Bus DC Parameters
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
Notes
VIH
VIL
Input-high voltage
Input-low voltage
2.0
V
V
1
2
0.8
VOH
Output-high voltage
Output-low voltage
Input-leakage current
IOUT = -4 mA
IOUT = 4 mA
0 < VIN < VCCP
2.4
V
V
0.4
5
V
OL
IIL
-5
-5
µA
Output-leakage
current
IOL
0 < VIN < VCCP
5
µA
CINCLK
CIO
Notes:
Input-pin capacitance
I/O-pin capacitance
4
5
pF
pF
3
3
1.
V
IH overshoot: VIH (MAX) = VCCP + 2 V for a pulse width < 3 ns, and the pulse width cannot be greater
than one third of the cycle rate.
IL undershoot: VIL (MIN) = -2 V for a pulse width < 3 ns cannot be exceeded.
These values are typical values seen by the manufacturing process and are not tested.
2.
3.
V
5.4.8
Expansion Bus DC Parameters
Table 32.
Expansion Bus DC Parameters (Sheet 1 of 2)
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
Notes
VIH
VIL
Input-high voltage
Input-low voltage
Output-high voltage
2.0
V
V
V
0.8
VOH
IOUT = -4 mA
2.4
1
Notes:
1.
2.
Test conditions were a 70 pF load to ground.
These values are typical values seen by the manufacturing process and are not tested.
March 2005
88
Datasheet
Document Number: 252479, Revision: 005
INTEL [ INTEL ]
