28F320J5 and 28F640J5
Table 1. Lead Descriptions
Symbol
Type
Name and Function
BYTE-SELECT ADDRESS: Selects between high and low byte when the device is in x8 mode.
A
INPUT
This address is latched duringa x8 program cycle. Not used in x16 mode (i.e., the A input buffer
0
0
is turned off when BYTE# is high).
ADDRESS INPUTS: Inputs for addresses duringread and program operations. Addresses are
internally latched duringa program cycle.
A –A
INPUT
1
22
32-Mbit: A –A
0
21
22
64-Mbit: A –A
0
LOW-BYTE DATA BUS: Inputs data during buffer writes and programming, and inputs
commands duringCommand User Interface (CUI) writes. Outputs array, query, identifier, or status
data in the appropriate read mode. Floated when the chip is de-selected or the outputs are
INPUT/
OUTPUT
DQ –DQ
0
7
disabled. Outputs DQ –DQ are also floated when the Write State Machine (WSM) is busy. Check
6
0
SR.7 (status register bit 7) to determine WSM status.
HIGH-BYTE DATA BUS: Inputs data duringx16 buffer writes and programmingoperations.
Outputs array, query, or identifier data in the appropriate read mode; not used for status register
reads. Floated when the chip is de-selected, the outputs are disabled, or the WSM is busy.
INPUT/
OUTPUT
DQ –DQ
8
15
CHIP ENABLES: Activates the device’s control logic, input buffers, decoders, and sense
amplifiers. When the device is de-selected (see Table 2 on pag e 12, power reduces to standby
levels.
CE ,
0
CE ,
INPUT
INPUT
1
2
All timingspecifications are the same for these three signals. Device selection occurs with the first
CE
edge of CE , CE , or CE that enables the device. Device deselection occurs with the first edge of
0
1
2
CE , CE , or CE that disables the device (see Table 2).
0
1
2
RESET/ POWER-DOWN: Resets internal automation and puts the device in power-down mode.
RP#-high enables normal operation. Exit from reset sets the device to read array mode. When
driven low, RP# inhibits write operations which provides data protection duringpower transitions.
RP#
RP# at V enables master lock-bit settingand block lock-bits configuration when the master
HH
lock-bit is set. RP# = V overrides block lock-bits thereby enablingblock erase and
programming operations to locked memory blocks. Do not permanently connect RP# to V
HH
.
HH
OUTPUT ENABLE: Activates the device’s outputs through the data buffers during a read cycle.
OE# is active low.
OE#
WE#
INPUT
INPUT
WRITE ENABLE: Controls writes to the Command User Interface, the Write Buffer, and array
blocks. WE# is active low. Addresses and data are latched on the risingedge of the WE# pulse.
STATUS: Indicates the status of the internal state machine. When configured in level mode
(default mode), it acts as a RY/BY# pin. When configured in one of its pulse modes, it can pulse to
indicate program and/or erase completion. For alternate configurations of the STATUS pin, see
OPEN
DRAIN
OUTPUT
STS
the Configurations command. Tie STS to V
with a pull-up resistor.
CCQ
BYTE ENABLE: BYTE# low places the device in x8 mode. All data is then input or output on
DQ –DQ , while DQ –DQ float. Address A selects between the high and low byte. BYTE# high
0
7
8
15
0
BYTE#
INPUT
places the device in x16 mode, and turns off the A input buffer. Address A then becomes the
0
1
lowest order address.
ERASE / PROGRAM / BLOCK LOCK ENABLE: For erasingarray blocks, programmingdata, or
configuring lock-bits.
V
INPUT
PEN
With V
≤ V
, memory contents cannot be altered.
PENLK
PEN
V
V
SUPPLY
DEVICE POWER SUPPLY: With V ≤ V
, all write attempts to the flash memory are inhibited.
LKO
CC
CC
OUTPUT
BUFFER
SUPPLY
OUTPUT BUFFER POWER SUPPLY: This voltage controls the device’s output voltages. To
obtain output voltages compatible with system data bus voltages, connect V
supply voltage.
to the system
CCQ
CCQ
GND
NC
SUPPLY
GROUND: Do not float any ground pins.
NO CONNECT: Lead is not internally connected; it may be driven or floated.
Datasheet
9