LIST OF FIGURES
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Figure 15
Figure 16
Figure 17
Figure 18
Figure 19
Figure 20
Figure 21
Figure 22
PAGE
The 80960SA Processor’s Highly Parallel Architecture ................................................................ 0
80960SA Programming Environment ........................................................................................... 1
Instruction Formats ...................................................................................................................... 4
Multiple Register Sets Are Stored On-Chip .................................................................................. 5
Connection Recommendation for LOCK .................................................................................... 11
Typical Supply Current vs. Case Temperature ........................................................................... 12
Typical Current vs. Frequency (Room Temp) ............................................................................. 12
Typical Current vs. Frequency (Hot Temp) ................................................................................. 13
Capacitive Derating Curve ......................................................................................................... 13
Test Load Circuit for Three-State Output Pins ............................................................................ 13
Drive Levels and Timing Relationships for 80960SA Signals ..................................................... 15
Processor Clock Pulse (CLK2) ................................................................................................... 19
RESET Signal Timing ................................................................................................................. 19
HOLD Timing .............................................................................................................................. 20
80-Lead EIAJ Quad Flat Pack (QFP) Package .......................................................................... 21
84-Lead Plastic Leaded Chip Carrier (PLCC) Package ............................................................. 22
Non-Burst Read and Write Transactions Without Wait States .................................................... 28
Quad Word Burst Read Transaction With 1, 0, 0, 0, 0, 0, 0, 0 Wait States ................................ 29
Burst Write Transaction With 2, 1, 1, 1 Wait States (6-8 Bytes Transferred) .............................. 30
Accesses Generated by Quad Word Read Bus Request,
Misaligned One Byte from Quad Word Boundary 1, 0, 0, 0, 0, 0, 0, 0 Wait States ..................... 31
Interrupt Acknowledge Cycle ...................................................................................................... 32
Cold Reset Waveform ................................................................................................................ 33
LIST OF TABLES
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Table 8
Table 9
Table 10
Table 11
Table 12
Table 13
Table 14
Table 15
80960SA Instruction Set .............................................................................................................. 3
Memory Addressing Modes ......................................................................................................... 4
80960SA Pin Description: Bus Signals ........................................................................................ 8
80960SA Pin Description: Support Signals ................................................................................ 10
DC Characteristics ..................................................................................................................... 14
80960SA AC Characteristics (10 MHz) ...................................................................................... 16
80960SA AC Characteristics (16 MHz) ...................................................................................... 17
80960SA AC Characteristics (20 MHz) ...................................................................................... 18
80960SA QFP Pinout — In Pin Order ........................................................................................ 23
80960SA QFP Pinout — In Signal Order ................................................................................... 24
80960SA PLCC Pinout — In Pin Order ...................................................................................... 25
80960SA PLCC Pinout — In Signal Order ................................................................................. 26
80960SA QFP Package Thermal Characteristics ...................................................................... 27
80960SA PLCC Package Thermal Characteristics .................................................................... 27
Die Stepping Cross Reference ................................................................................................... 27
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